Laird SDC-SSD30AG Hardware Integration Manual Download Page 25

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SDC-SSD30AG

Hardware Integration Guide, version 3.3

Americas: +1-800-492-2320 Option 2
Europe: +44-1628-858-940

Hong Kong: +852-2268-6567 x026

www.lairdtech.com/wireless

Laird Technologies

Português

[Portuguese]

[Nome do fabricante] declara que este [tipo de equipamento] está conforme com os
requisitos essenciais e outras disposições da Directiva 1999/5/CE.

Slovensko

[Slovenian]

[Ime proizvajalca] izjavlja, da je ta [tip opreme] v skladu z bistvenimi zahtevami in
ostalimi relevantnimi dolo

ili direktive 1999/5/ES.

Slovensky

[Slovak]

[Meno výrobcu] týmto vyhlasuje, že [typ zariadenia] sp

ĺň

a základné požiadavky a

všetky príslušné ustanovenia Smernice 1999/5/ES.

Suomi [Finnish] [Valmistaja = manufacturer] vakuuttaa täten että [type of equipment = laitteen

tyyppimerkintä] tyyppinen laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä
koskevien direktiivin muiden ehtojen mukainen.

Svenska

[Swedish]

Härmed intygar

[företag] att denna [utrustningstyp] står I överensstämmelse med de

väsentliga egenskapskrav och övriga relevanta bestämmelser som framgår av direktiv
1999/5/EG.

Summary of Contents for SDC-SSD30AG

Page 1: ...SDC SSD30AG HARDWARE INTEGRATION GUIDE VERSION 3 3 Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2268 6567 x026 www lairdtech com wireless ...

Page 2: ...ised pin definitions Revised DC Electrical Characteristics table Revised Power Sequence Operations information Removed schematic 1 06 05 04 10 Added I O signal details 1 07 05 27 10 Updated images added SDIO Interface Timing information revised pin definitions 1 08 08 24 10 Updated block diagram 1 09 12 28 10 Revised mechanical drawings 1 10 01 12 11 Revised Pinout table 2 0 04 05 11 Corrections t...

Page 3: ... Scope 4 Operational Description 4 Block Diagram 5 Specifications 5 DC Electrical Characteristics 10 SDIO Interface Timing 11 Pin Definitions 12 SSD30AG and SSD40NBT Pin Comparison Table 14 Electrical Considerations 15 Mechanical Specifications 16 Mounting 19 RF Layout Design Guidelines 20 Regulatory 20 Certified Antennas 20 Documentation Requirements 21 FCC 21 Industry Canada 22 European Union 23...

Page 4: ...e SDC SSD30AG will fully conform to commands from the infrastructure for radar avoidance The SDC SSD30AG is a System in Package SiP Quad Flat pack No leads QFN module and interfaces to host devices via 58 pads on the perimeter of the package The device is based on the Atheros AR6002 chip which is an integrated device providing a Media Access Controller MAC a Physical Layer Controller PHY or baseba...

Page 5: ... 3 3 VDC 10 core I O Signaling Voltage 1 8 or 3 3 VDC 10 Current Consumption At maximum transmit power setting 802 11a Transmit 380 mA 1254 mW Receive 115 mA 380 mW Standby 3 mA 10 mW 802 11b g Transmit 325 mA 1072 mW Receive 95 mA 314 mW Standby 2 mA 7 mW Operating Temperature 30 to 70 C 22 to 158 F Operating Humidity 10 to 90 non condensing Storage Temperature 30 to 85 C 22 to 185 F Storage Humi...

Page 6: ... and 18 Mbps CCK 5 5 and 11 Mbps 16 QAM 24 and 36 Mbps 64 QAM 48 and 54 Mbps Regulatory Domain Support FCC Americas Parts of Asia and Middle East ETSI Europe Middle East Africa and Parts of Asia MIC Japan formerly TELEC KCC Korea 2 4 GHz Frequency Bands ETSI 2 4 GHz to 2 483 GHz FCC 2 4 GHz to 2 473 GHz MIC 2 4 GHz to 2 495 GHz KCC 2 4 GHz to 2 483 GHz 5 GHz Frequency Bands ETSI 5 15 GHz to 5 35 G...

Page 7: ... mW 15 dBm 30 mW 13 dBm 20 mW 10 dBm 10 mW 7 dBm 5 mW 0 dBm 1 mW Typical Receiver Sensitivity Note All values nominal 3 dBm Note Receiver Sensitivity values are measured at the antenna interface pins on the SDC SSD30AG Integrators can expect a minimum routing loss such as 0 25 dB for 2 4 GHz operation and 0 5 dB for 5 GHz operation when mounting the SDC SSD30AG on an appropriate PCB 802 11a 6 Mbps...

Page 8: ...ting Systems Supported Windows Mobile 6 5 Windows Mobile 6 1 Windows Mobile 6 0 Windows Mobile 5 0 Windows Embedded CE 6 0 R3 Windows Embedded CE 6 0 R2 Windows Embedded CE 6 0 Windows Embedded CE 5 0 Security Standards Wireless Equivalent Privacy WEP Wi Fi Protected Access WPA IEEE 802 11i WPA2 Encryption Wireless Equivalent Privacey WEP RC4 Algorithm Temporal Key Integrity Protocol TKIP RC4 Algo...

Page 9: ...28 EN 301 489 EN 301 893 EN 60950 1 EU 2002 95 EC RoHS FCC Regulatory Domain Part 15 247 Subpart C Grant Test Report Part 15 407 Subpart E Grant Test Report DFS Test Report Industry Canada RSS 210 RSS Gen Issue 2 Grant Test Report Test Report Certifications Wi Fi Alliance 802 11a 802 11b 802 11g WPA Enterprise WPA2 Enterprise Cisco Compatible Extensions Version 4 Warranty Limited Lifetime All spec...

Page 10: ... 2 mA 7 mW mA VDDIO Digital I O Reference Voltage 1 71 1 8 3 46 V IVDDIO Digital I O Current 0 05 0 40 mA VIH High Level Input Voltage 0 8 x VDDIO VDD 0 3 V VIL Low Level Input Voltage 0 3 0 2 x VDDIO V VOH High Level Output Voltage VDDIO 0 35 V VOL Low Level Output Voltage 0 40 V CIN Input Capacitance 6 pF The SSD30AG has an internal pull down on CHIP_PWD_L so when the host pulls it high the pad ...

Page 11: ... and maximum VIL b fPP Clock frequency data transfer mode 0 25 MHz tWL Clock low time 10 ns tWH Clock high time 10 ns tTLH Clock rise time 10 ns tTHL Clock fall time 10 ns Inputs CMD Data referenced to CLK tISU Input setup time 5 ns tIH Input hold time 5 ns Outputs CMD Data referenced to CLK tO_DLY min Output delay time during data transfer mode 0 14 ns tO_DLY max Output delay time during data tra...

Page 12: ...nector 6 GND Ground 7 GND Ground 8 GND Ground 9 GND Ground 10 ANT_1 Antenna 1 Main 50 ohm coplanar wave guide to antenna or antenna connector 11 GND Ground 12 GND Ground 13 GND Ground 14 GND Ground 15 GND Ground 16 GND Ground 17 GND Ground 18 GND Ground 19 RSVD N C Reserved No Connect 20 RSVD N C Reserved No Connect 21 RSVD N C Reserved No Connect 22 RSVD N C Reserved No Connect 23 VCC3_3 3 3V Mod...

Page 13: ...dio then released before any transaction can start See Electrical Considerations for the recommended SYS_RST_L circuitry See Note 2 36 CHIP_PWD_L I VDDIO Powers down the radio active low 4 7K pull up resistor to VDDIO is recommended See Note 2 37 RSVD N C Reserved No Connect 38 SDIO_DATA_0 I O VDDIO SDIO Data 0 Internal pull up No external pull up required 39 GND Ground 40 SDIO_CLK I VDDIO SDIO Cl...

Page 14: ... RSVD N C Reserved No Connect 55 RSVD N C Reserved No Connect 56 RSVD N C Reserved No Connect Note 1 on LED Support WL_LED_ACT Implementation on the SSD30AG or MSD30AG WL_LED_ACT has an internal pull down and thus is low when the radio is off not powered Note The SSD30AG and MSD30AG devices require the SD30AG driver release 3 3 3 and greater Driver control implementation when enabled WL_LED_ACT is...

Page 15: ... SDIO_DATA_0 SDIO_DATA_0 11 GND GND 39 GND GND 12 GND GND 40 SDIO_CLK SDIO_CLK 13 GND GND 41 GND GND 14 GND GND 42 SDIO_DATA_1 SDIO_DATA_1 15 GND GND 43 SDIO_DATA_3 SDIO_DATA_3 16 GND GND 44 SDIO_DATA_2 SDIO_DATA_2 17 GND GND 45 SDIO_CMD SDIO_CMD 18 GND GND 46 GND GND 19 RSVD BT_PCM_OUT 47 RSVD CLK_32K 20 RSVD BT_WAKE_B 48 SDIO_SEL SDIO_SEL 21 RSVD BT_HOST_WAKE_B 49 WLAN_ACTIVE WLAN_ACTIVE 22 RSVD...

Page 16: ...268 6567 x026 www lairdtech com wireless 16 Laird Technologies your reference only to aid you in integrating the SSD30AG into your device MECHANICAL SPECIFICATIONS Note DWG files are available from the Summit website Please contact Summit for additional information or to request a different file type SiP Photo Bottom View ...

Page 17: ... Europe 44 1628 858 940 Hong Kong 852 2268 6567 x026 www lairdtech com wireless 17 Laird Technologies Note The ground pad beneath the SiP radio should be the ground plane of your circuit board The exposed portion of the ground pad beneath the SiP is controlled by the Solder Mask layer ...

Page 18: ...SDC SSD30AG Hardware Integration Guide version 3 3 Americas 1 800 492 2320 Option 2 Europe 44 1628 858 940 Hong Kong 852 2268 6567 x026 www lairdtech com wireless 18 Laird Technologies ...

Page 19: ...ing for Pads 1 1 to 1 0 9 dependent on solder type Solder Stencil Opening for Thermal Pads 9 window pane pads 1 0 5 to 1 0 75 dependent on solder type Note The vias that are in the thermal pad 6x6 pattern of 12 mil holes are open they are not tented by the solder mask on the bottom side This allows excess paste to escape from the bottom side to help ensure a flat SIP installation Solder Paste Type...

Page 20: ...o use the Main pin 10 antenna interface and should disable transmit and receive diversity from the Global tab of the Summit Client Utility SCU software utility Summit does not have specific regulatory approvals for the SDC SSD30AG Summit has regulatory approvals for the SDC MSD30AG which is a PCB module that is based on the SDC SSD30AG As such the ETSI FCC and Industry Canada final test reports fo...

Page 21: ...by the applicable regulatory agencies The following sections FCC Industry Canada and European Union outline the information that must be included in the user s guide and external labels for the host devices into which the SDC SSD30AG is integrated FCC User s Guide Requirements When integrating the SDC SSD30AG into a host device the integrator must include specific information in the user s guide f...

Page 22: ...y Industry Canada User s Guide Requirements When integrating the SDC SSD30AG into a host device the integrator must include specific information in the user s guide for the device into which the SDC SSD30AG is integrated The integrator must not provide information to the end user regarding how to install or remove this RF module in the user s manual of the device into which the SDC SSD30AG is inte...

Page 23: ... 2 of the R TTE Directive EN 301 489 1 V1 6 1 2005 09 Electromagnetic compatibility and Radio Spectrum Matters ERM ElectroMagnetic Compatibility EMC standard for radio equipment and services Part 1 Common technical requirements EN 301 489 17 V1 2 1 2002 08 Electromagnetic compatibility and Radio spectrum Matters ERM ElectroMagnetic Compatibility EMC standard for radio equipment and services Part 1...

Page 24: ...ufacturer ΔΗΛΩΝΕΙ ΟΤΙ type of equipment ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩΔΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ ΤΙΣ ΛΟΙΠΕΣ ΣΧΕΤΙΚΕΣ ΔΙΑΤΑΞΕΙΣ ΤΗΣ ΟΔΗΓΙΑΣ 1999 5 ΕΚ Français French Par la présente nom du fabricant déclare que l appareil type d appareil est conforme aux exigences essentielles et aux autres dispositions pertinentes de la directive 1999 5 CE Italiano Italian Con la presente nome del costruttore dichiara che ...

Page 25: ... z bistvenimi zahtevami in ostalimi relevantnimi določili direktive 1999 5 ES Slovensky Slovak Meno výrobcu týmto vyhlasuje že typ zariadenia spĺňa základné požiadavky a všetky príslušné ustanovenia Smernice 1999 5 ES Suomi Finnish Valmistaja manufacturer vakuuttaa täten että type of equipment laitteen tyyppimerkintä tyyppinen laite on direktiivin 1999 5 EY oleellisten vaatimusten ja sitä koskevie...

Page 26: ... Europe 44 1628 858 940 Hong Kong 852 2268 6567 x026 www lairdtech com wireless 26 Laird Technologies APPENDIX A SCHEMATIC Because the SDC MSD30AG is a PCB module that is based on the SDC SSD30AG the following SDC MSD30AG schematic may be used as a reference Figure 2 MSD30AG Schematic ...

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