SDC-SSD30AG
Hardware Integration Guide, version 3.3
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Laird Technologies
Mounting
The SDC-SSD30AG is a Quad Flat pack with No Leads (QFN) System in Package (SiP). Summit has mounted
this device to a PCB with a host and antenna connectors and markets that radio module as the SDC-
MSD30AG. The following information results from Summit’s experience in producing the SDC-MSD30AG.
Summit provides these data for informational purposes only and provides no warranties or claims with regard
to the applicability of this information to a particular design.
Solder Stencil Opening for Pads: 1:1 to 1:0.9 (dependent on solder type)
Solder Stencil Opening for Thermal Pads (9 “window pane” pads): 1:0.5 to 1:0.75
(dependent on solder type)
Note: The vias that are in the thermal pad (6x6 pattern of 12 mil holes)
are open; they are not tented by the solder mask on the bottom
side. This allows excess paste to escape from the bottom side to
help ensure a flat SIP installation.
Solder Paste Type: No-Clean as the soldered part to board clearance will not allow for adequate post solder
cleaning
Solder Pad Size:
1 mm long by 0.4 mm wide. Solder pads longer than 1 mm may contact portions of the
SSD30AG metal shield resulting in a short circuit.
Reflow:
The SDC-SSD30AG is RoHS compliant and as such is sensitive to heat. The following
graphic details a typical profile for such and device and is provided for reference
purposes.
Figure 1: Footprint from the
Summit MSD30/40 PCB
