AM4011
Thermal Considerations
ID 1022-1626, Rev. 1.0
Page 6 - 3
P R E L I M I N A R Y
6.
Thermal Considerations
The following chapters provide system integrators with the necessary information to satisfy
thermal and airflow requirements when implementing AM4011 applications.
6.1
Thermal Monitoring
To ensure optimal operation and long-term reliability of the AM4011, all onboard components
must remain within the maximum temperature specifications. The most critical components on
the AM4011 are the processor and the chipset. Operating the AM4011 above the maximum op-
erating limits will result in permanent damage to the board. To ensure functionality at the max-
imum temperature, the BIOS and the Module Management Controller support several
temperature monitoring and control features.
The AM4011 includes six temperature sensors that are accessible via the Module Management
Controller. They are distributed over the complete board to measure the onboard temperature
values and regulate the board's power consumption.
The AM4011 uses the following temperature sensors:
•
Inlet board temperature sensor near the AMC Card-edge connector
(Inlet AMC Sensor)
•
Outlet board temperature sensor near the AMC Card-edge connector
(Outlet AMC Sensor)
•
Inlet board temperature sensor near the processor (Inlet Processor Sensor)
•
Outlet board temperature sensor near the processor (Outlet Processor Sensor)
•
Thermal Diode Sensor on the Intel® Core™2 Duo processor
•
Thermal Diode Sensor on the Intel® 3100 chipset
