M-SS-017-07 Rev C
5
SERVO
STAR
CD
UNPACKING AND INSPECTING
Open the box(es) and remove all the contents. Check to ensure there is no visible damage to any of the
equipment.
WARNING
Electronic components in this amplifier are design hardened to reduce static sensitivity.
However, proper procedures should be used when handling.
WARNING
Remove all packing material and equipment from the shipping container. Be aware that
some connector kits and other equipment pieces may be quite small and can be
accidentally discarded if care is not observed when unpacking the equipment. Do not
dispose of shipping materials until the packing list has been checked.
CAUTION
Upon receipt of the equipment, inspect components to ensure that no damage has
occurred in shipment. If damage is detected, notify the carrier immediately. Check all
shipping material for connector kits, manuals, diskettes, and other small pieces of
equipment.
G
ROUNDING
System grounding is essential for proper performance of the drive system. A ground bus bar may be used
as a single point ground for the system. Safety grounding should be provided to all pieces of the system
from a “star point." In addition to the safety grounding, a high frequency ground must be provided that
connects the back panel to the enclosure and, ultimately, to earth ground. The objective is to provide an
extremely low impedance path between the filters, drives, power supplies, and earth ground. This high
frequency ground is accomplished with the use of a flat braid or copper bus bar. It is important not to rely
on a standard wire for the high frequency ground. In general, a wire has an inductance of 8 nH-per-inch,
regardless of diameter. At higher frequencies, this unwanted inductance between grounds equates to
limited filter performance. When connecting high frequency grounds, use the shortest braid possible.
B
ONDING
The proper bonding of shielded cables is imperative for minimizing noise emissions and increasing
immunity levels of the drive system. Its effect is to reduce the impedance between the cable shield and
the back panel. Danaher Motion recommends that all shielded cables be bonded to the back panel.
Power input wiring does not require shielding (screening) if the power is fed to the cabinet (enclosure) via
metallized conduit. If the metallized conduit is used with proper high frequency grounds, bonding
technology, and recommended wire routing, then power input wire shielding has no affect. In the event
that metallized conduit is not implemented into the system, shielded cable is required on the power input
wires and proper bonding technologies should be implemented.
The motor and feedback cables should have the shield exposed as close to the drive as possible. This
exposed shield is bonded to the back panel using either non-insulated metallic cable clamps or cable
bonding clamps offered by Phoenix Contact (and others). Refer to the
Installation Manual
for details.
CE F
ILTERING
T
ECHNIQUES
The SERVO
STAR
®
drive system (BUS Module, drive, motor) meets the CE Mark standards stated in the
front of this manual. It is imperative for you to apply proper bonding and grounding techniques, described
earlier in this section, when incorporating EMC noise filtering components for the purpose of meeting this
standard.
Noise currents often occur in two types. The first is conducted emissions that are passed through ground
loops. The quality of the system grounding scheme inversely determines the noise amplitudes in the lines.
These conducted emissions are of a common-mode nature from line to neutral (or ground). The second is
radiated high-frequency emissions usually capacitively coupled from line-to-line and are differential in
nature.
To properly mount the filters, the enclosure should have an unpainted metallic surface. This allows for
more surface area to be in contact with the filter housing and provides a lower impedance path between
this housing and the back plane. The back panel, in turn, has a high frequency ground strap connection
to the enclosure frame or earth ground.
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