Intel BX80623I32100, Datasheet

Page: 79 / 112

Datasheet, Volume 1 79
Electrical Specifications
7.9 Storage Conditions Specifications
Environmental storage condition limits define the temperature and relative humidity
that the device is exposed to while being stored in a moisture barrier bag. The specified
storage conditions are for component level prior to board attach.
Table 7-4 specifies absolute maximum and minimum storage temperature limits that
represent the maximum or minimum device condition beyond which damage, latent or
otherwise, may occur. The table also specifies sustained storage temperature, relative
humidity, and time-duration limits. These limits specify the maximum or minimum
device storage conditions for a sustained period of time. Failure to adhere to the
following specifications can affect long term reliability of the processor.
Notes:
1. Refers to a component device that is not assembled in a board or socket and is not electrically connected to
a voltage reference or I/O signal.
2. Specified temperatures are not to exceed values based on data collected. Exceptions for surface mount
reflow are specified by the applicable JEDEC standard. Non-adherence may affect processor reliability.
3. T
absolute storage
applies to the unassembled component only and does not apply to the shipping media,
moisture barrier bags, or desiccant.
4. Component product device storage temperature qualification methods may follow JESD22-A119 (low temp)
and JESD22-A103 (high temp) standards when applicable for volatile memory.
5. Intel branded products are specified and certified to meet the following temperature and humidity limits
that are given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C and Humidity: 50%
to 90%, non-condensing with a maximum wet bulb of 28 °C.) Post board attach storage temperature limits
are not specified for non-Intel branded boards.
6. The JEDEC J-JSTD-020 moisture level rating and associated handling practices apply to all moisture
sensitive devices removed from the moisture barrier bag.
7. Nominal temperature and humidity conditions and durations are given and tested within the constraints
imposed by T
sustained storage
and customer shelf life in applicable Intel boxes and bags.
Table 7-4. Storage Condition Ratings
Symbol Parameter Min Max Notes
T
absolute storage
The non-operating device storage
temperature. Damage (latent or otherwise)
may occur when exceeded for any length of
time.
-25 °C 125 °C 1, 2, 3, 4
T
sustained storage
The ambient storage temperature (in
shipping media) for a sustained period of time
-5 °C 40 °C 5, 6
T
short term storage
The ambient storage temperature (in
shipping media) for a short period of time.
-20 °C 85 °C
RH
sustained storage
The maximum device storage relative
humidity for a sustained period of time.
60% at 24 °C 6, 7
Time
sustained storage
A prolonged or extended period of time;
typically associated with customer shelf life.
0 Months 30 Months 7
Time
short term storage
A short-period of time. 0 hours 72 hours