Datasheet, Volume 1
81
Electrical Specifications
Notes:
1.
Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical
data. These specifications will be updated with characterized data from silicon measurements at a later
date.
2.
Each processor is programmed with a maximum valid voltage identification value (VID) that is set at
manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing
such that two processors at the same frequency may have different settings within the VID range. Note
that this differs from the VID employed by the processor during a power management event (Adaptive
Thermal Monitor, Enhanced Intel SpeedStep Technology, or Low Power States).
3.
The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the
socket with a 20-MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1-M
Ω
minimum
impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external
noise from the system is not coupled into the oscilloscope probe.
4.
ICC_MAX specification is based on the V
CC
loadline at worst case (highest) tolerance and ripple.
5.
The V
CC
specifications represent static and transient limits.
6.
The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage
regulation feedback for voltage regulator circuits must also be taken from processor VCC_SENSE and
VSS_SENSE lands.
7.
PSx refers to the voltage regulator power state as set by the SVID protocol.
8.
2011A (processors with 35 W TDP) loadline slope, TOB, and ripple specifications allow for a cost reduced
voltage regulator for boards supporting only the 2011A (processors with 35 W TDP). 2011A (processors
with 35 W TDP) processors may also use the loadline slope, TOB, and ripple specifications for the 2011D
(processors with 95 W TDP), 2011C (processors with 65 W TDP), and 2011B (processors with 45 W TDP).
I
CC
2011B (processors with 45 W TDP)
I
CC
—
—
60
A
4
I
CC
2011A (processors with 35 W TDP)
I
CC
—
—
35
A
4
I
CC_TDC
2011D (processors with 95 W
TDPs) Sustained I
CC
—
—
85
A
4
I
CC_TDC
2011C (processors with 65 W TDP)
Sustained I
CC
—
—
55
A
4
I
CC_TDC
2011B (processors with 45 W TDP)
Sustained I
CC
—
—
40
A
4
I
CC_TDC
2011A (processors with 35 W TDP)
Sustained I
CC
—
—
25
A
4
Table 7-5.
Processor Core Active and Idle Mode DC Voltage and Current Specifications
(Sheet 2 of 2)
Symbol
Parameter
Min
Typ
Max
Unit
Note
1
Summary of Contents for BX80623I32100
Page 34: ...Interfaces 34 Datasheet Volume 1...
Page 42: ...Technologies 42 Datasheet Volume 1...
Page 58: ...Power Management 58 Datasheet Volume 1...
Page 60: ...Thermal Management 60 Datasheet Volume 1...
Page 70: ...Signal Description 70 Datasheet Volume 1...
Page 88: ...Electrical Specifications 88 Datasheet Volume 1...
Page 108: ...Processor Pin and Signal Information 108 Datasheet Volume 1...