Chapter 1: Introduction
3. During the subsystem initialization stage, the cooling fans operate
at the high speed and return to lower speed once the initialization
process is completed and that the subsystem has not discovered
any erroneous conditions.
NOTE:
Cooling module specifications are listed in Appendix A.
1.2.7 Host I/O Modules
Figure 1-22: Host I/O Module
PN: IFT-9273CF4HIO2L (left-side module; CH0)
IFT-9273CF4HIO2R (right-side module; CH1)
Host I/O modules are located along the upper edge of enclosure rear panel
and are secured to the chassis by retention screws. (See
Figure 1-22
) Each
module provides two (2) SFP sockets that receive 4Gbps optical
transceivers. The Fibre Channel host ports receive 4.25/2.125GBd SFP, LC
duplex type transceivers and then connect to LC-type cables.
You can order the SFP tranceivers from your subsystem vendor. (P/N: IFT-
9270CSFP4GA01) These SFP tranceivers have been selected and tested to
provide the necessary reliability and performance.
All host connection modules come with bypass circuits so that host ports
can be routed to both controllers. The bypass circuits ensure loop integrity
and allow you to configure redundant data paths to the host computers
without expensive FC switches in a DAS application. For configurations
involving multiple data paths, you may connect host links through external
FC switches or enable the onboard hub for direct connections. For details of
these options, please refer to
Chapter 4
.
Two (2) LEDs come with each SFP port to indicate link and speed statuses.
These modules are hot-swappable.
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