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IMDES CREATIVE SOLUTIONS Schulstrasse 21  D-48455 Bad Bentheim /Gildehaus  Germany T:+49(0)5924-997337 E

[email protected]

  

  

www.imdes.de

  SKYPE marc.van Stralen                                                                                 

© 2019

 

IMDES CREATIVE SOLUTIONS 

 

 

 

 

High vapor density. 

 

Excellent heat transfer coefficient. 

 

Low surface tension. 

 

Good wetting properties (film adhesion). 

 

There will be no harmful substances released during the process. 

 

No chemical activity (perfluoriert, i.e. no H-or CI-Atom). 

 

During the heating of the heat transfer medium under normal atmospheric pressure, all types Galden are 
thermally stable. 

 

Does not damage the ozone layer.

 

 
 

1.6 Why condensation soldering? 

 
For contemporary complex BGA, FPGA and the new generation complex to solder SMD components, this solder 

method is the only method which is relatively simple, even for the amateur and hobbyist to achieve 

perfect

 solder 

results 

 
Moreover, one can also easy remove, without damaging, major components such as FPGA’s using simple auxiliary 

tools. 
 
Reflow Soldering (called reflow technique) of Printed Circuit Boards with SMD components are/were mostly done in 

an infrared oven, possibly, with nitrogen as shielding gas to prevent oxidization of solder joints. 
 

On the introduction of lead-free soldering, it was found that this infrared soldering was sensitive to the occurrence 
of defects at the connection between the components and the PCB.  
 

Due the increasing requirements for higher quality and reliability of circuit boards, search was launched for better 
solder methods and the "vapour phase" condensation soldering was rediscovered as an alternative method to the 

infrared "reflow" soldering. 

 

1.7 Benefits of condensation soldering 

 

Soldering takes place in a space filled with inert gas, so no oxygen or other gases will be coming in contact with 
the soldering surfaces and components. This is why a shielding gas such as nitrogen is no longer needed. The heat 

transfer takes place by a fluid film, which is much more direct and more effective than radiation or air heating. 
 
 

 
 

 
 
 

 
 

 
 

 
 
 

 
 

This creates an extremely high efficiency. Overheating is impossible because the temperature of the vapour will 
never exceed the boiling point of the liquid, which is fixed by the chemical composition of the liquid. 
 

 
 

 
 

 

Summary of Contents for DINO-CONDENS-IT

Page 1: ...van Stralen 2019 IMDES CREATIVE SOLUTIONS 1 DINO CONDENS IT PROFILER The perfect method to solder SMD components at the highest solder quality Preliminary Owner s Manual Version 2 0Tuesday February 5...

Page 2: ...nical inaccuracies or typographical errors Information may be changed or updated without notice IMDES CREATIVE SOLUTIONS may make improvements and or changes in the materials machine at any time witho...

Page 3: ...1 13 2 Installation and commissioning 13 1 13 3 The stainless steel lid with glass observation window 13 1 14 Handling Tips 14 1 14 1 Handling of the DINO CONDENS IT 14 1 14 2 General operating instru...

Page 4: ...th without N2 Vapor Phase 26 4 1 5 Bridging short circuits or bridges between pads 26 4 1 6 Solder Beads 26 4 1 7 Pop Corning 28 4 1 8 Poor Wetting 28 4 1 9 Voiding 28 5 0 Double Sided Printed Circuit...

Page 5: ...hall NOT be exceeded under any circumstances 1 1 Technical Data Power Supply Single phase 220 240 Volt 50 60 Hz Power Connector Three Prong Power Connector Max heating capacity 2500 Watt ca 12 A Dimen...

Page 6: ...the same temperature as the boiling liquid When the assembled printed circuit boards is brought into this space the vapor will condense on the surface because the circuit board has a lower temperatur...

Page 7: ...ed Circuit Boards with SMD components are were mostly done in an infrared oven possibly with nitrogen as shielding gas to prevent oxidization of solder joints On the introduction of lead free solderin...

Page 8: ...B regardless of the shape or colour Absolute uniform heating of the PCB Condensation vapour causes a thin liquid film that penetrates to the smallest openings resulting in reliable soldering of BGAs a...

Page 9: ...d at the bottom of the process chamber 2 Transfer liquid is heated to the boiling point Step 2 The heat transfer liquid Galden is active It boils at 230 C and is in active phase PCB with components is...

Page 10: ...0 Step 3 1 Temperature of the assembled PCB reaches temperature of the transfer fluid PCB temp Vapour temp 2 Vapour starts to rise again Step 4 1 Reflow process will be terminated by switching off the...

Page 11: ...ess chamber cover sensor A micro switch monitors if the process chamber cover is present and closed If you open the cover before the end of the process the system is switched off When the there is no...

Page 12: ...ch DINO CONDENS IT Item FLEX DINO CONDENS IT 1 no Lid Cover with glass window 1 no This owner s manual 1 no AC Power cable 1 no Dipstick to measure the Galden Level in the process chamber 1 no Pump 10...

Page 13: ...hange of air underneath the DINO CONDENS IT 1 13 3 The stainless steel lid with glass observation window GALDEN is an expensive liquid and hence we have optimized the DINO CONDENS IT to have the lowes...

Page 14: ...right away 1 14 1 Handling of the DINO CONDENS IT With the construction of DINO CONDENS IT great attention was given to a simple reliable and straightforward design for ease of handling and low cost...

Page 15: ...without prior consultation with IMDES CREATIVE SOLUTIONS Use personal protection while operating the system Observe all applicable national regulations and safety regulations for accident prevention a...

Page 16: ...rning GALDEN decomposes when heated above 295 C 563 F into harmful components The DINO CONDENS IT does NOT check automatically if there is sufficient level of GALDEN in the process chamber Therefor yo...

Page 17: ...move the soldered part and product carrier We strongly discourage the use of pliers tweezers or similar tools to remove the soldered parts as they may slip from the tool and fall into the liquid Galde...

Page 18: ...n this zone The work piece surface is heated to the temperature of the boiling liquid vapour The temperature of the vapor is determined by the temperature of the boiling point of liquid and will not e...

Page 19: ...s IMDES CREATIVE SOLUITIONS Copy right Paul Keizer Ver 1 15 or an other Ver Version release No When pressing the green key the soldering process starts with the last saved profile in Eeprom and starts...

Page 20: ...and red key simultaneously to enter the next menu If you want to activate the Anti tombstone mode you must enter values into the AntiTombStTime Menu If you do not want to change anything in a menu yo...

Page 21: ...low modus the machine is continually sensing the Galden Temperature and automatically switch of de heaters and starting the cool down if the Galden temperature exceeds its limits ANTI TOMBSTONE REFLOW...

Page 22: ...pressing the plunger of the syringe 9 Repeat the procedure until process chamber is empty 10 When the process chamber is empty place the DINO CONDENS IT in horizontal position 11 The DINO CONDENS IT...

Page 23: ...from the delivery date The warranty is void if The machine is not operated as per the procedure detailed here in and or operated without the liquid Galden filled in the process chamber If any modific...

Page 24: ...em in earning capacity It is here where the vapor phase as the only soldering system offers the inestimable advantage to continue using all hereto known and processed materials The costs of the machin...

Page 25: ...oo high Generally due to the careful heating with vapor phase soldering the solder ball formation is greatly reduced 4 1 2 Wicking Effect The wicking effect is the rise of the molten solder on compone...

Page 26: ...far apart to prevent the surface tension of the solder to pull the component to one side This will make it impossible to produce a solder contact on its other side due to an insufficient contact area...

Page 27: ...is oxidation influence may be well observed in convection machines Switching off the nitrogen supply is a frequently used trick to eliminate tombstoning with known failure prone assemblies Without nit...

Page 28: ...The dangerous of the popcorn effect is that it is not immediately detected as it occurs under the device for example are BGAs Vapor phase soldering significantly reduces this error probability 4 1 8...

Page 29: ...costs As the adhesives are cured without oxygen no oxides will form on the printed circuit boards which results in improved solder quality Advantage of having a single profile to cure adhesive and to...

Page 30: ...inly laid out designed with small chips 7 2 Step 1 We start with Screen printing the B side of the double side PCB with smallest components Placing the components Reflowing PCB Side B with the compone...

Page 31: ...f the A side with large components To screen the A side of the PCB you need to use a PCB support holder Use for the PCB support holder material that is thicker than the populated PCB and thick enough...

Page 32: ...ndoffs See Fig below You ll damage the SMT solder joints from the first reflow if you lay the board directly on the product carrier Standoffs You can use any material that can withstand the condensati...

Page 33: ...OLUTIONS Schulstrasse 21 D 48455 Bad Bentheim Gildehaus Germany T 49 0 5924 997337 E info imdes de www imdes de SKYPE marc van Stralen 2019 IMDES CREATIVE SOLUTIONS 33 7 6 DUAL SIDED MIXED SMD THT ASS...

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