IMDES CREATIVE SOLUTIONS Schulstrasse 21 D-48455 Bad Bentheim /Gildehaus Germany T:+49(0)5924-997337 E:
© 2019
IMDES CREATIVE SOLUTIONS
7
High vapor density.
Excellent heat transfer coefficient.
Low surface tension.
Good wetting properties (film adhesion).
There will be no harmful substances released during the process.
No chemical activity (perfluoriert, i.e. no H-or CI-Atom).
During the heating of the heat transfer medium under normal atmospheric pressure, all types Galden are
thermally stable.
Does not damage the ozone layer.
1.6 Why condensation soldering?
For contemporary complex BGA, FPGA and the new generation complex to solder SMD components, this solder
method is the only method which is relatively simple, even for the amateur and hobbyist to achieve
perfect
solder
results
Moreover, one can also easy remove, without damaging, major components such as FPGA’s using simple auxiliary
tools.
Reflow Soldering (called reflow technique) of Printed Circuit Boards with SMD components are/were mostly done in
an infrared oven, possibly, with nitrogen as shielding gas to prevent oxidization of solder joints.
On the introduction of lead-free soldering, it was found that this infrared soldering was sensitive to the occurrence
of defects at the connection between the components and the PCB.
Due the increasing requirements for higher quality and reliability of circuit boards, search was launched for better
solder methods and the "vapour phase" condensation soldering was rediscovered as an alternative method to the
infrared "reflow" soldering.
1.7 Benefits of condensation soldering
Soldering takes place in a space filled with inert gas, so no oxygen or other gases will be coming in contact with
the soldering surfaces and components. This is why a shielding gas such as nitrogen is no longer needed. The heat
transfer takes place by a fluid film, which is much more direct and more effective than radiation or air heating.
This creates an extremely high efficiency. Overheating is impossible because the temperature of the vapour will
never exceed the boiling point of the liquid, which is fixed by the chemical composition of the liquid.