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IMDES CREATIVE SOLUTIONS Schulstrasse 21  D-48455 Bad Bentheim /Gildehaus  Germany T:+49(0)5924-997337 E

[email protected]

  

  

www.imdes.de

  SKYPE marc.van Stralen                                                                                 

© 2019

 

IMDES CREATIVE SOLUTIONS 

 

18 

 

 

 
 

2.0 Operating the 

DINO-CONDENS-

IT

 

 

2.1 The proceedings at the IMDES CONDENS-IT Profiler 

 

1.

 

Turn on the main switch. 

 

2.

 

Blue LED at the front of the machine will turn on after switching on and the green LED at the control panel 

will start to glow a few seconds later if the lid is in place on top of process Chamber.                                                 
                                            

3.

 

Open the cover of the system, and then place the work piece onto the 

product carrier

 

4.

 

 Close the cover lid. 

 

5.

 

Press the 

Start switch

 

Green Button

 

to execute the "reflow process”. 

 

6.

 

Yellow 

and

 

RED 

LED Start to Burn 

 

7.

 

When the RED LED does not start to burn the LID is not good closed micro switch is not 
activated and the heater will not switched in 
 

8.

 

 System heats up the applied "heat transfer" liquid to its boiling point. The resulting vapour rises up and 
condenses on the surface of the work piece to be soldered and transfers its thermal energy to the work 

piece. 
 

9.

 

The solder Oxidation is avoided as vapour is chemically inert and no oxygen present in this zone. The work 
piece surface is heated to the temperature of the boiling liquid vapour. The temperature of the vapor is 
determined by the temperature of the boiling point of liquid and will not exceed. 

 

10.

 

After reaching the boiling temperature (= the vapour temperature) of the liquid, vapour rises until it 

reaches the vapour temperature sensor and the heating elements are turned off. 
 

11.

 

The cooling fans start cooling process chamber and as the temperature of the vapours come down, it 

starts to condense to liquid form and collects at the bottom of the process chamber. The remaining 
condensate remains on the work piece and will evaporate by the own heat of the work piece.  

 

12.

 

When the blowers are stopped the cooling procedure comes to an end. 

13.

 

 Next open the lid of the system and 

remove the soldered work piece

 from the 

product carrier

 
The entire procedure takes approximately 10 to 15 minutes. 

 
The consumption of the Galden medium is minimal, especially if the work piece is adequately cooled after reflowing 

and the lid remains closed during the process.  
 
In the 

DINO-CONDENS-

IT

 is a micro switch built into the top of the unit so the "reflow process" can only be 

started up if the lid is closed. 
 

Basically no harmful vapours are generated during the reflow process other than the flux fumes during the reflow 
process, which can be exhausted out. 

Summary of Contents for DINO-CONDENS-IT

Page 1: ...van Stralen 2019 IMDES CREATIVE SOLUTIONS 1 DINO CONDENS IT PROFILER The perfect method to solder SMD components at the highest solder quality Preliminary Owner s Manual Version 2 0Tuesday February 5...

Page 2: ...nical inaccuracies or typographical errors Information may be changed or updated without notice IMDES CREATIVE SOLUTIONS may make improvements and or changes in the materials machine at any time witho...

Page 3: ...1 13 2 Installation and commissioning 13 1 13 3 The stainless steel lid with glass observation window 13 1 14 Handling Tips 14 1 14 1 Handling of the DINO CONDENS IT 14 1 14 2 General operating instru...

Page 4: ...th without N2 Vapor Phase 26 4 1 5 Bridging short circuits or bridges between pads 26 4 1 6 Solder Beads 26 4 1 7 Pop Corning 28 4 1 8 Poor Wetting 28 4 1 9 Voiding 28 5 0 Double Sided Printed Circuit...

Page 5: ...hall NOT be exceeded under any circumstances 1 1 Technical Data Power Supply Single phase 220 240 Volt 50 60 Hz Power Connector Three Prong Power Connector Max heating capacity 2500 Watt ca 12 A Dimen...

Page 6: ...the same temperature as the boiling liquid When the assembled printed circuit boards is brought into this space the vapor will condense on the surface because the circuit board has a lower temperatur...

Page 7: ...ed Circuit Boards with SMD components are were mostly done in an infrared oven possibly with nitrogen as shielding gas to prevent oxidization of solder joints On the introduction of lead free solderin...

Page 8: ...B regardless of the shape or colour Absolute uniform heating of the PCB Condensation vapour causes a thin liquid film that penetrates to the smallest openings resulting in reliable soldering of BGAs a...

Page 9: ...d at the bottom of the process chamber 2 Transfer liquid is heated to the boiling point Step 2 The heat transfer liquid Galden is active It boils at 230 C and is in active phase PCB with components is...

Page 10: ...0 Step 3 1 Temperature of the assembled PCB reaches temperature of the transfer fluid PCB temp Vapour temp 2 Vapour starts to rise again Step 4 1 Reflow process will be terminated by switching off the...

Page 11: ...ess chamber cover sensor A micro switch monitors if the process chamber cover is present and closed If you open the cover before the end of the process the system is switched off When the there is no...

Page 12: ...ch DINO CONDENS IT Item FLEX DINO CONDENS IT 1 no Lid Cover with glass window 1 no This owner s manual 1 no AC Power cable 1 no Dipstick to measure the Galden Level in the process chamber 1 no Pump 10...

Page 13: ...hange of air underneath the DINO CONDENS IT 1 13 3 The stainless steel lid with glass observation window GALDEN is an expensive liquid and hence we have optimized the DINO CONDENS IT to have the lowes...

Page 14: ...right away 1 14 1 Handling of the DINO CONDENS IT With the construction of DINO CONDENS IT great attention was given to a simple reliable and straightforward design for ease of handling and low cost...

Page 15: ...without prior consultation with IMDES CREATIVE SOLUTIONS Use personal protection while operating the system Observe all applicable national regulations and safety regulations for accident prevention a...

Page 16: ...rning GALDEN decomposes when heated above 295 C 563 F into harmful components The DINO CONDENS IT does NOT check automatically if there is sufficient level of GALDEN in the process chamber Therefor yo...

Page 17: ...move the soldered part and product carrier We strongly discourage the use of pliers tweezers or similar tools to remove the soldered parts as they may slip from the tool and fall into the liquid Galde...

Page 18: ...n this zone The work piece surface is heated to the temperature of the boiling liquid vapour The temperature of the vapor is determined by the temperature of the boiling point of liquid and will not e...

Page 19: ...s IMDES CREATIVE SOLUITIONS Copy right Paul Keizer Ver 1 15 or an other Ver Version release No When pressing the green key the soldering process starts with the last saved profile in Eeprom and starts...

Page 20: ...and red key simultaneously to enter the next menu If you want to activate the Anti tombstone mode you must enter values into the AntiTombStTime Menu If you do not want to change anything in a menu yo...

Page 21: ...low modus the machine is continually sensing the Galden Temperature and automatically switch of de heaters and starting the cool down if the Galden temperature exceeds its limits ANTI TOMBSTONE REFLOW...

Page 22: ...pressing the plunger of the syringe 9 Repeat the procedure until process chamber is empty 10 When the process chamber is empty place the DINO CONDENS IT in horizontal position 11 The DINO CONDENS IT...

Page 23: ...from the delivery date The warranty is void if The machine is not operated as per the procedure detailed here in and or operated without the liquid Galden filled in the process chamber If any modific...

Page 24: ...em in earning capacity It is here where the vapor phase as the only soldering system offers the inestimable advantage to continue using all hereto known and processed materials The costs of the machin...

Page 25: ...oo high Generally due to the careful heating with vapor phase soldering the solder ball formation is greatly reduced 4 1 2 Wicking Effect The wicking effect is the rise of the molten solder on compone...

Page 26: ...far apart to prevent the surface tension of the solder to pull the component to one side This will make it impossible to produce a solder contact on its other side due to an insufficient contact area...

Page 27: ...is oxidation influence may be well observed in convection machines Switching off the nitrogen supply is a frequently used trick to eliminate tombstoning with known failure prone assemblies Without nit...

Page 28: ...The dangerous of the popcorn effect is that it is not immediately detected as it occurs under the device for example are BGAs Vapor phase soldering significantly reduces this error probability 4 1 8...

Page 29: ...costs As the adhesives are cured without oxygen no oxides will form on the printed circuit boards which results in improved solder quality Advantage of having a single profile to cure adhesive and to...

Page 30: ...inly laid out designed with small chips 7 2 Step 1 We start with Screen printing the B side of the double side PCB with smallest components Placing the components Reflowing PCB Side B with the compone...

Page 31: ...f the A side with large components To screen the A side of the PCB you need to use a PCB support holder Use for the PCB support holder material that is thicker than the populated PCB and thick enough...

Page 32: ...ndoffs See Fig below You ll damage the SMT solder joints from the first reflow if you lay the board directly on the product carrier Standoffs You can use any material that can withstand the condensati...

Page 33: ...OLUTIONS Schulstrasse 21 D 48455 Bad Bentheim Gildehaus Germany T 49 0 5924 997337 E info imdes de www imdes de SKYPE marc van Stralen 2019 IMDES CREATIVE SOLUTIONS 33 7 6 DUAL SIDED MIXED SMD THT ASS...

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