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IMDES CREATIVE SOLUTIONS Schulstrasse 21  D-48455 Bad Bentheim /Gildehaus  Germany T:+49(0)5924-997337 E

[email protected]

  

  

www.imdes.de

  SKYPE marc.van Stralen                                                                                 

© 2019

 

IMDES CREATIVE SOLUTIONS 

 

20 

 

 

 

 
 

GaldenBoilingPt the boiling point of the Galden to be  
This can be changed by using the 

green

 and 

red key

 

(in steps of 5 degrees from 200 °c 

<-> 260 °c) 

• 

Green Key

 

for lower value 

• 

Red key

 

for a higher value 

 

Profile Choice

 Sets the preheating time of the solder profile in  steps of 30 

seconds of entry  (0 seconds is a lineair profile)  

 

 

 

PreheatTemp 

PreheatTemp in this menu you can change the preheating 

temperature in steps1 degree. 

 

 

 

 

 

BoilingTime   

(=this is time above liquid)

 

In this menu you are able to enter the 

boiling Time Above Liquid  (TAL) in steps of 1 second when the galden vapor has 
reached its boiling temperature ( for example 230 degrees)

 

 
2.5

 The 

Anti-Tombstone

 mode 

(ATS)

 is not activated by default

(ATS) can be activated if he tombstone effect occurs during the solder reflow process  

If you do not want to change anything in the menu AntiTombStTime you need to press the 

green

 and 

red

 key 

simultaneously to enter the next menu.

 

If you want to 

activate the Anti-tombstone mode

, you must enter 

values

 into the 

AntiTombStTime

 

  Menu

 

 

 

 

 

 

 

 

 

 

If you do not want to change anything in a menu, you must press the 

green 

and 

red keys

 

simultaneously to 

enter the next menu

.

 

 

 

 

 
 
 

 
 

The machine will then automatically switch to the Reflowsolder mode according to the parameters you have 
entered.

 

If you do not wish this

  

 

Press the 

black RESET

 button the machine will restart. 

The display then displays the boot menu showing the last saved data (for example). 

 

 
 
 
 

By pressing 

the Green key 

the reflow process will start using the saved data in EEPROM.

 

 
 
 

 

 
 

If all data is entered correctly, you can save the data in EEPROM by pressing the 

Redbutton

 

PreheatTemp     + 
       150

 

°

C       -

 

 

GaldenBo 

        230 

°

C          

 

Profilechoice      + 

           0 sec      - 

 

BoilingTime        + 

     30 sec          -

 

Gal 230 

°    

Pht 150 

Prof 60s    GrB=ok        

 

 

AntiTomb Temp  +   

      200 

°

 C   -

 

 

 

AntiTombStTime  + 
          54 sec      -

 

AntiTomb Temp

 Default values in the menu are already entered:

AntiTomb Temp  +  200 ° C 

(

for lead free solder alloys

)    

 

  

AntiTomb Temp  +  160 ° C 

(

for lead containing solder alloys

)    

 

You have to enter a value  

>

 then  0 Seconds

.

  

The total “

AntiTombStTime”

 

  must be entered in increments of 1 Second

 

Then press 

green

 

and 

red key

 

simultaneously and you come into the menu

 

 

Write to Eeprom? 

Red button= Yes 

Summary of Contents for DINO-CONDENS-IT

Page 1: ...van Stralen 2019 IMDES CREATIVE SOLUTIONS 1 DINO CONDENS IT PROFILER The perfect method to solder SMD components at the highest solder quality Preliminary Owner s Manual Version 2 0Tuesday February 5...

Page 2: ...nical inaccuracies or typographical errors Information may be changed or updated without notice IMDES CREATIVE SOLUTIONS may make improvements and or changes in the materials machine at any time witho...

Page 3: ...1 13 2 Installation and commissioning 13 1 13 3 The stainless steel lid with glass observation window 13 1 14 Handling Tips 14 1 14 1 Handling of the DINO CONDENS IT 14 1 14 2 General operating instru...

Page 4: ...th without N2 Vapor Phase 26 4 1 5 Bridging short circuits or bridges between pads 26 4 1 6 Solder Beads 26 4 1 7 Pop Corning 28 4 1 8 Poor Wetting 28 4 1 9 Voiding 28 5 0 Double Sided Printed Circuit...

Page 5: ...hall NOT be exceeded under any circumstances 1 1 Technical Data Power Supply Single phase 220 240 Volt 50 60 Hz Power Connector Three Prong Power Connector Max heating capacity 2500 Watt ca 12 A Dimen...

Page 6: ...the same temperature as the boiling liquid When the assembled printed circuit boards is brought into this space the vapor will condense on the surface because the circuit board has a lower temperatur...

Page 7: ...ed Circuit Boards with SMD components are were mostly done in an infrared oven possibly with nitrogen as shielding gas to prevent oxidization of solder joints On the introduction of lead free solderin...

Page 8: ...B regardless of the shape or colour Absolute uniform heating of the PCB Condensation vapour causes a thin liquid film that penetrates to the smallest openings resulting in reliable soldering of BGAs a...

Page 9: ...d at the bottom of the process chamber 2 Transfer liquid is heated to the boiling point Step 2 The heat transfer liquid Galden is active It boils at 230 C and is in active phase PCB with components is...

Page 10: ...0 Step 3 1 Temperature of the assembled PCB reaches temperature of the transfer fluid PCB temp Vapour temp 2 Vapour starts to rise again Step 4 1 Reflow process will be terminated by switching off the...

Page 11: ...ess chamber cover sensor A micro switch monitors if the process chamber cover is present and closed If you open the cover before the end of the process the system is switched off When the there is no...

Page 12: ...ch DINO CONDENS IT Item FLEX DINO CONDENS IT 1 no Lid Cover with glass window 1 no This owner s manual 1 no AC Power cable 1 no Dipstick to measure the Galden Level in the process chamber 1 no Pump 10...

Page 13: ...hange of air underneath the DINO CONDENS IT 1 13 3 The stainless steel lid with glass observation window GALDEN is an expensive liquid and hence we have optimized the DINO CONDENS IT to have the lowes...

Page 14: ...right away 1 14 1 Handling of the DINO CONDENS IT With the construction of DINO CONDENS IT great attention was given to a simple reliable and straightforward design for ease of handling and low cost...

Page 15: ...without prior consultation with IMDES CREATIVE SOLUTIONS Use personal protection while operating the system Observe all applicable national regulations and safety regulations for accident prevention a...

Page 16: ...rning GALDEN decomposes when heated above 295 C 563 F into harmful components The DINO CONDENS IT does NOT check automatically if there is sufficient level of GALDEN in the process chamber Therefor yo...

Page 17: ...move the soldered part and product carrier We strongly discourage the use of pliers tweezers or similar tools to remove the soldered parts as they may slip from the tool and fall into the liquid Galde...

Page 18: ...n this zone The work piece surface is heated to the temperature of the boiling liquid vapour The temperature of the vapor is determined by the temperature of the boiling point of liquid and will not e...

Page 19: ...s IMDES CREATIVE SOLUITIONS Copy right Paul Keizer Ver 1 15 or an other Ver Version release No When pressing the green key the soldering process starts with the last saved profile in Eeprom and starts...

Page 20: ...and red key simultaneously to enter the next menu If you want to activate the Anti tombstone mode you must enter values into the AntiTombStTime Menu If you do not want to change anything in a menu yo...

Page 21: ...low modus the machine is continually sensing the Galden Temperature and automatically switch of de heaters and starting the cool down if the Galden temperature exceeds its limits ANTI TOMBSTONE REFLOW...

Page 22: ...pressing the plunger of the syringe 9 Repeat the procedure until process chamber is empty 10 When the process chamber is empty place the DINO CONDENS IT in horizontal position 11 The DINO CONDENS IT...

Page 23: ...from the delivery date The warranty is void if The machine is not operated as per the procedure detailed here in and or operated without the liquid Galden filled in the process chamber If any modific...

Page 24: ...em in earning capacity It is here where the vapor phase as the only soldering system offers the inestimable advantage to continue using all hereto known and processed materials The costs of the machin...

Page 25: ...oo high Generally due to the careful heating with vapor phase soldering the solder ball formation is greatly reduced 4 1 2 Wicking Effect The wicking effect is the rise of the molten solder on compone...

Page 26: ...far apart to prevent the surface tension of the solder to pull the component to one side This will make it impossible to produce a solder contact on its other side due to an insufficient contact area...

Page 27: ...is oxidation influence may be well observed in convection machines Switching off the nitrogen supply is a frequently used trick to eliminate tombstoning with known failure prone assemblies Without nit...

Page 28: ...The dangerous of the popcorn effect is that it is not immediately detected as it occurs under the device for example are BGAs Vapor phase soldering significantly reduces this error probability 4 1 8...

Page 29: ...costs As the adhesives are cured without oxygen no oxides will form on the printed circuit boards which results in improved solder quality Advantage of having a single profile to cure adhesive and to...

Page 30: ...inly laid out designed with small chips 7 2 Step 1 We start with Screen printing the B side of the double side PCB with smallest components Placing the components Reflowing PCB Side B with the compone...

Page 31: ...f the A side with large components To screen the A side of the PCB you need to use a PCB support holder Use for the PCB support holder material that is thicker than the populated PCB and thick enough...

Page 32: ...ndoffs See Fig below You ll damage the SMT solder joints from the first reflow if you lay the board directly on the product carrier Standoffs You can use any material that can withstand the condensati...

Page 33: ...OLUTIONS Schulstrasse 21 D 48455 Bad Bentheim Gildehaus Germany T 49 0 5924 997337 E info imdes de www imdes de SKYPE marc van Stralen 2019 IMDES CREATIVE SOLUTIONS 33 7 6 DUAL SIDED MIXED SMD THT ASS...

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