System reliability guidelines
To help ensure proper cooling and system reliability, make sure that the following
requirements are met:
v
Each of the drive bays has a drive or a filler panel and electromagnetic
compatibility (EMC) shield installed in it.
v
You have followed the cabling instructions that come with optional adapters.
v
You have replaced a hot-swap drive within 2 minutes of removal.
v
The system-board tray battery is operational. If the battery becomes defective,
replace it immediately.
v
Microprocessor socket 2 always contains either a microprocessor baffle or a
microprocessor and heat sink.
Handling static-sensitive devices
Attention:
Static electricity can damage the server and other electronic devices.
To avoid damage, keep static-sensitive devices in their static-protective packages
until you are ready to install them.
To reduce the possibility of damage from electrostatic discharge, observe the
following precautions:
v
Limit your movement. Movement can cause static electricity to build up around
you.
v
The use of a grounding system is recommended. For example, wear an
electrostatic-discharge wrist strap, if one is available.
v
Handle the device carefully, holding it by its edges or its frame.
v
Do not touch solder joints, pins, or exposed circuitry.
v
Do not leave the device where others can handle and damage it.
v
While the device is still in its static-protective package, touch it to an
unpainted
metal surface on the outside of the chassis or rack for at least 2 seconds. This
drains static electricity from the package and from your body.
v
Remove the device from its package and install it directly into the system-board
tray or enclosure without setting down the device. If it is necessary to set down
the device, put it back into its static-protective package. Do not place the device
on a metal surface.
v
Take additional care when you handle devices during cold weather. Heating
reduces indoor humidity and increases static electricity.
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IBM dx340 User’s Guide
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