HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 09 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
23
Pin
No.
Pin Name
Pad
Type
Description
Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Comments
132
GND
-
Thermal Ground Pad
-
-
-
-
-
133
GND
-
Thermal Ground Pad
-
-
-
-
-
134
GND
-
Thermal Ground Pad
-
-
-
-
-
135
GND
-
Thermal Ground Pad
-
-
-
-
-
136
GND
-
Thermal Ground Pad
-
-
-
-
-
137
GND
-
Thermal Ground Pad
-
-
-
-
-
138
GND
-
Thermal Ground Pad
-
-
-
-
-
139
GND
-
Thermal Ground Pad
-
-
-
-
-
140
GND
-
Thermal Ground Pad
-
-
-
-
-
141
GND
-
Thermal Ground Pad
-
-
-
-
-
142
GND
-
Thermal Ground Pad
-
-
-
-
-
143
GND
-
Thermal Ground Pad
-
-
-
-
-
144
GND
-
Thermal Ground Pad
-
-
-
-
-
145
GND
-
Thermal Ground Pad
-
-
-
-
-
I
indicates pins for digital signal input;
O
indicates pins for digital signal output;
PI
indicates
power input pins;
PO
indicates power output pins.
V
IL
indicates low-level input voltage;
V
IH
indicates high-level input voltage;
V
OL
indicates
low-level output voltage;
V
OH
indicates high-level output voltage.
The
NC
(Not Connected) pins are floating and there are no signal connected to these pins.
The
Reserved
pins are internally connected to the module. Therefore, these pins should not
be used, otherwise they may cause problems. Please contact us for more details about this
information.
3.3 Power Interface
3.3.1 Overview
The power supply part of the MU709 module contains:
VBAT pins for the power supply
VCC_EXT1 pin for external power output with 1.8 V
USIM_VCC pin for USIM card power output
SD_VCC pin for SD card power output for debugging.
Table 3-2 lists the definitions of the pins on the power supply interface.
