HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 09 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
36
Pin
No. Pin Name
Pad
Type Description Parameter
Min.(V)
Typ.
(V)
Max.(V) Comments
V
IL
0
-
0.25 x
USIM_
VCC
90
USIM_CLK O
USIM card
clock
V
OH
0.7 x
USIM_VCC
-
3.3
USIM_VC
C=1.8 V or
3.0 V
V
OL
0
-
0.2 x
USIM_
VCC
70
USIM_DE
T
I
USIM
Detection
V
IH
1.26
1.8
2.1
The signal
is internally
pulled up.
Keep
USIM_DE
T floating,
if it is not
used.
V
IL
–0.3
-
0.63
34
USIM_VC
C
PO
Power
supply for
USIM card
-
–0.3
1.8
1.98
USIM_VC
C=1.8 V
–0.3
3.0
3.3
USIM_VC
C=3.0 V
3.7.2 Circuit Recommended for the USIM Card Interface
As the MU709 module is not equipped with a USIM socket, you need to place a USIM
socket on the user interface board. Figure 3-14 shows the circuit of the USIM card
interface.
Figure 3-14
Circuit of the USIM card interface
USIM
Module
(DCE)
33 pF 33 pF 33 pF
33 pF
ESD protection
USIM-VCC
USIM-DET
USIM-CLK
USIM-DATA
USIM-RESET
100 nF
1 µF
0 Ω
0 Ω
0 Ω
0 Ω
470 pF
1 kΩ