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HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide

Appendix B Acronyms and

Abbreviations

Issue 09 (2017-12-15)

Huawei Proprietary and Confidential

Acronym or Abbreviation

Expansion

DTE

Data Terminal Equipment

DRX

Discontinuous Reception

DVK

Development Kit

ECC

Envelope Correlation Coefficient

EDGE

Enhanced Data Rate for GSM Evolution

EIA

Electronic Industries Association

EMC

Electromagnetic Compatibility

ENIG

Electroless Nickel Immersion Gold

EPA

Electrostatic Discharge Protected Area

ESD

Electrostatic Discharge

European Union

EVDO

Evolution Data Optimized

FCC

Federal Communications Commission

FDD

Frequency Division Duplex

GMSK

Gaussian Minimum Shift Keying

GPIO

General Purpose I/O

GPRS

General Packet Radio Service

GPS

Global Positioning System

GSM

Global System for Mobile Communication

GLONASS/GNSS

Global Navigation Satellite System

HBM

Human Body Model

HSDPA

High Speed Downlink Packet Access

HSPA

Enhanced High Speed Packet Access

HSUPA

High Speed Up-link Packet Access

Integrated Circuit

IMC

Inter Metallic Compound

IMT

International Mobile Telephony

ISO

International Standards Organization

JTAG

Joint Test Action Group

LCD

Liquid Crystal Display

Summary of Contents for MU709s-2

Page 1: ...HUAWEI MU709 Series HSPA LGA Module Hardware Guide Issue 09 Date 2017 12 15 ...

Page 2: ...BY APPLICABLE LAWS NO WARRANTIES OF ANY KIND EITHER EXPRESS OR IMPLIED INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE MADE IN RELATION TO THE ACCURACY RELIABILITY OR CONTENTS OF THIS MANUAL TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW IN NO EVENT SHALL HUAWEI BE LIABLE FOR ANY SPECIAL INCIDENTAL INDIRECT OR CONSEQUENTIAL DAMAGES...

Page 3: ...escription of MU709s 6 Module 05 2015 05 20 3 3 2 Updated Section 3 3 2 Power Supply VBAT Interface 06 2015 11 30 3 2 Updated the description of PS_HOLD signal in Table 3 1 3 3 2 Updated Section 3 3 2 Power Supply VBAT Interface 3 14 Added the description of PS_HOLD signal in Section 3 14 Test Points Design 3 5 Updated Section 3 5 UART Interface 6 5 Updated Section 6 5 Packaging 07 2016 09 07 2 Up...

Page 4: ... Co Ltd 4 Document Version Date Chapter Descriptions 6 5 Updated Packaging 6 6 2 Updated Figure 6 4 LGA module Footprint design Unit mm 6 8 2 Updated Stencil Design 6 9 3 Updated Equipment used for rework 08 2017 06 28 8 13 1 Updated section 8 13 1 EU Regulatory Conformance 09 2017 12 15 Deleted Privacy Policy Added Software Update Scope MU709s 2 MU709s 6 ...

Page 5: ...ace 23 3 3 1 Overview 23 3 3 2 Power Supply VBAT Interface 24 3 3 3 Output Power Supply Interface 25 3 4 Signal Control Interface 25 3 4 1 Overview 25 3 4 2 Power on off Pin 26 3 4 3 RESIN_N 28 3 4 4 WAKEUP_IN Signal 29 3 4 5 WAKEUP_OUT Signal 30 3 4 6 SLEEP_STATUS Signal 30 3 4 7 LED_MODE Signal 31 3 5 UART Interface 32 3 5 1 Overview 32 3 5 2 Circuit Recommended for the UART Interface 33 3 6 USB...

Page 6: ...icators 49 4 5 2 Interference 52 4 5 3 Antenna Requirements 52 5 Electrical and Reliability Features 54 5 1 About This Chapter 54 5 2 Absolute Ratings 54 5 3 Operating and Storage Temperatures and Humidity 54 5 4 Power Supply Features 55 5 4 1 Input Power Supply 55 5 4 2 Power Consumption 56 5 5 Reliability Features 60 5 6 EMC and ESD Features 63 6 Mechanical Specifications 65 6 1 About This Chapt...

Page 7: ...7 1 About This Chapter 77 7 2 Certifications 77 8 Safety Information 78 8 1 Interference 78 8 2 Medical Device 78 8 3 Area with Inflammables and Explosives 78 8 4 Traffic Security 79 8 5 Airline Security 79 8 6 Safety of Children 79 8 7 Environment Protection 79 8 8 WEEE Approval 79 8 9 RoHS Approval 79 8 10 Laws and Regulations Observance 80 8 11 Care and Maintenance 80 8 12 Emergency Call 80 8 1...

Page 8: ...1 Introduction This document describes the hardware application interfaces and air interfaces provided by HUAWEI MU709 series MU709s 2 and MU709s 6 HSPA LGA module hereinafter referred to as the MU709 module This document helps hardware engineer to understand the interface specifications electrical features and related product information of the MU709 module ...

Page 9: ...nction Overview Table 2 1 Features Feature Description Physical Dimensions Dimensions L W H 30 mm 30 mm 2 27 mm Weight about 5 g Operating Bands MU709s 2 WCDMA HSDPA HSUPA HSPA Band 1 Band 8 GSM GPRS EDGE 850 MHz 900 MHz 1800 MHz 1900 MHz MU709s 6 WCDMA HSDPA HSUPA HSPA Band 1 Band 2 Band 5 GSM GPRS EDGE 850 MHz 900 MHz 1800 MHz 1900 MHz Operating Temperature Normal operating temperature 20 C to 7...

Page 10: ...erface JTAG interface SLEEP_STATUS WAKEUP_IN WAKEUP_OUT Antenna Interface WWAN MAIN antenna pad x1 WWAN AUX antenna pad x 1 SMS New message alert Management of SMS read SMS write SMS send SMS delete SMS and list SMS Supports MO and MT Point to point Data Services GPRS UL 85 6 kbit s DL 85 6 kbit s EDGE UL 236 8 kbit s DL 236 8 kbit s WCDMA PS UL 384 kbit s DL 384 kbit s HSPA UL 5 76 Mbit s DL 21 6...

Page 11: ...wei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 11 Figure 2 1 Circuit block diagram of the MU709 module BB RFIC and Front end circuits LGA Interface VBAT USIM Power on off GPIO GND PCM USB UART JTAG WAKE Jamming Detection USIM_Switch USIM_DET MAIN_ANT AUX_ANT LED Nand flash ...

Page 12: ...the MU709 module UART Interface The module supports 2 UART interfaces One is 8 wire UART0 and the other is 2 wire UART1 only for debugging USB Interface The USB interface supports USB 2 0 high speed standard USIM Interface The USIM interface provides the interface for a USIM card External Power Supply DC 3 8 V is recommended Audio Interface The module supports one PCM interface LED Indicates the w...

Page 13: ...y describes the external application interfaces of the MU709 module including LGA Interface Power Interface Signal Control Interface UART Interface USB Interface USIM Card Interface Audio Interface General Purpose I O Interface JTAG Interface RF Antenna Interface Reserved Interface NC Interface Test Points Design 3 2 LGA Interface The MU709 module uses the 145 pin LGA as their external interface F...

Page 14: ...12 15 Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 14 Figure 3 1 shows the sequence of pins on the 145 pin signal interface of the MU709 module Figure 3 1 Sequence of LGA interface Top view Table 3 1 shows the definitions of pins on the 145 pin signal interface of the MU709 module ...

Page 15: ...pin is output when the module is used as PCM master input when the module is used as PCM slave VOL 0 0 45 6 PCM_DIN I PCM data in VIH 1 26 1 8 2 1 VIL 0 3 0 63 7 PCM_DOUT O PCM data out VOH 1 35 1 8 2 1 VOL 0 0 45 8 PCM_CLK O PCM clock VOH 1 35 1 8 2 1 The pin is output when the module is used as PCM master input when the module is used as PCM slave VOL 0 0 45 9 SD_DATA1 I O SD Card data signal On...

Page 16: ...t be greater than 100 us 3 3 3 8 4 2 13 VBAT PI Power supply input The rising time of VBAT must be greater than 100 us 3 3 3 8 4 2 14 PS_HOLD I Power supply hold signal to the module VIH 1 26 1 8 2 1 Only used for debugging Please reserve the test point VIL 0 3 0 63 15 SLEEP_STA TUS O Sleep status indicator H Module is in wakeup state L Module is in sleep state VOH 1 35 1 8 2 1 VOL 0 0 45 16 NC No...

Page 17: ...tput 1 75 1 8 1 85 33 NC Not connected 34 USIM_VCC PO Power supply for USIM card 0 3 1 8 1 98 USIM_VCC 1 8 V 0 3 3 0 3 3 USIM_VCC 3 0 V 35 Reserved Reserved please keep this pin open 36 JTAG_TRST _N I JTAG reset VIH 1 26 1 8 2 1 VIL 0 3 0 63 37 NC Not connected 38 NC Not connected 39 NC Not connected 40 NC Not connected 41 NC Not connected 42 JTAG_TCK I JTAG clock input VIH 1 26 1 8 2 1 VIL 0 3 0 ...

Page 18: ... O pins Default or USIM Switch control signal VOH 1 35 1 8 2 1 The function of this pin can be defined as GPIO or USIM Switch while the USIM Switch should be enabled by AT command VOL 0 0 45 VIH 1 26 1 8 2 1 VIL 0 3 0 63 56 GND Ground 57 NOT USED Do not design PAD 58 GND Ground 59 GND Ground 60 Reserved Reserved please keep this pin open 61 Reserved Reserved please keep this pin open 62 Reserved R...

Page 19: ... Only used for debugging Please reserve the test point VOH 2 25 3 0 3 3 VOL 0 0 75 70 USIM_DET I USIM Detection VIH 1 26 1 8 2 1 The signal is internally pulled up Keep USIM_DET floating if it is not used VIL 0 3 0 63 71 WAKEUP_O UT O Module to wake up the host VOH 1 35 1 8 2 1 VOL 0 0 45 72 JTAG_TDO O JTAG test data output VOH 1 35 1 8 2 1 VOL 0 0 45 73 UART0_DS R O UART0 data set ready VOH 1 35 ...

Page 20: ...ower on or power off VIH 1 26 1 8 2 1 VIL 0 3 0 63 82 NC Not connected 83 NC Not connected 84 NC Not connected 85 USB_DM I O USB Data defined in the USB 2 0 Specification 86 USB_DP I O USB Data defined in the USB 2 0 Specification 87 JTAG_TDI I JTAG test data input VIH 1 26 1 8 2 1 VIL 0 3 0 63 88 USIM_RESE T O USIM card reset VOH 0 7x USIM _VCC 3 3 USIM_VCC 1 8 V or 3 0 V VOL 0 0 2x USIM _VCC 89 ...

Page 21: ...nnected 94 NC Not connected 95 NC Not connected 96 NC Not connected 97 NC Not connected 98 NC Not connected 99 NC Not connected 100 RESIN_N I Reset module VIH 1 26 1 8 2 1 VIL 0 3 0 63 101 LED_MODE O Mode indicator Current sink Drive strength 10 mA 102 Reserved Reserved please keep this pin open 103 NC Not connected 104 Reserved Reserved please keep this pin open 105 GPIO1 I O General Purpose I O ...

Page 22: ...ult or Jamming detection VOH 1 35 1 8 2 1 The function of this pin can be defined as GPIO or Jamming detecti on while the Jamming detecti on should be enabled by AT command VOL 0 0 45 VIH 1 26 1 8 2 1 VIL 0 3 0 63 114 GND Ground 115 AUX_ANT RF AUX antenna pad 116 GND Ground 117 NC Not connected 118 NC Not connected 119 NC Not connected 120 NC Not connected 121 GND Thermal Ground Pad 122 GND Therma...

Page 23: ...al input O indicates pins for digital signal output PI indicates power input pins PO indicates power output pins VIL indicates low level input voltage VIH indicates high level input voltage VOL indicates low level output voltage VOH indicates high level output voltage The NC Not Connected pins are floating and there are no signal connected to these pins The Reserved pins are internally connected t...

Page 24: ...upplied through the VBAT pins and the voltage ranges from 3 3 V to 4 2 V typical value 3 8 V The 145 pin LGA provides two VBAT pins and some GND pins for external power input To ensure that the MU709 module works normally all the pins must be used efficiently When the MU709 module is used for different external applications pay special attention to the design for the power supply When the MU709 mo...

Page 25: ...or 1s at least The rising time of VBAT should be 100 µs at least Otherwise the module will be powered off 3 3 3 Output Power Supply Interface Output power supply interface is VCC_EXT1 USIM_VCC and SD_VCC Through VCC_EXT1 the module can supply 1 8 V power externally with an output current of 10 mA typical value for external level conversion or other applications If the module is in sleep mode the o...

Page 26: ...IH 1 26 1 8 2 1 VIL 0 3 0 63 11 WAKEUP_ IN I Sleep authorization signal H Sleep mode is disabled L Sleep mode is enabled default value VIH 1 26 1 8 2 1 The signal is internally pulled down The module will be waked up when it is externally pulled up VIL 0 3 0 63 71 WAKEUP_ OUT O Module to wake up the host H Wake up the host the module hold 1s high level voltage pulse and then output low level volta...

Page 27: ...ate MU709 module is powered on POWER_ON_OFF pin should be pulled down for 1 0s at least 2 Low when MU709 module is in power on state MU709 module is powered off POWER_ON_OFF pin should be pulled down for 4 0s at least Figure 3 3 Connections of the POWER_ON_OFF pin Power On Time Sequence After VBAT has been applied and is stable the POWER_ON_OFF signal is pulled down and then the module will boot u...

Page 28: ...id to USB D high About 7 0 s If the DTE needs to detect the PID VID of module during the BIOS phase the detection time should exceed the TPD time Power Off Time Sequence Figure 3 5 Power off timing sequence Table 3 6 Power off timing Parameter Comments Time Nominal values Units TPOFF POWER_ON_OFF turn off time 4 0 s TPD POWER_ON_OFF Valid to USB D low 4 0 s 3 4 3 RESIN_N The RESIN_N pin is used to...

Page 29: ...reset due to interference The MU709 module supports hardware reset function If the software of the MU709 module stops responding you can reset the hardware through the RESIN_N signal as shown in Figure 3 7 When a low level pulse is supplied through the RESIN_N pin the hardware will be reset After the hardware is reset the software starts powering on the module and reports relevant information acco...

Page 30: ...al devices Table 3 3 shows the definition of the WAKEUP_OUT signal Figure 3 9 shows recommended circuit of the WAKEUP_OUT pin Figure 3 9 Connections of the WAKEUP_OUT pin 3 4 6 SLEEP_STATUS Signal SLEEP_STATUS signal is used to indicate the sleep status of MU709 module The external devices can get to know whether the module is in sleep mode by reading SLEEP_STATUS pin When SLEEP_STATUS pin is in h...

Page 31: ... provides an LED_MODE signal to indicate the work status Table 3 7 State of the LED_MODE pin No Operating Status LED_MODE 1 No service Restricted service Outputs low 0 1s high 0 1s low 0 1s high 1 7s 2s cycle 2 Register to the network Outputs low 0 1s high 1 9s 2s cycle 3 Dial up successfully Outputs low Figure 3 11 shows the recommended circuits of the LED_MODE pin According to LED feature you ca...

Page 32: ...T have the following features Full duplex 7 bit or 8 bit data 1 bit or 2 bit stop bit Odd parity check even parity check or non check Baud rate clock generated by the system clock Direct memory access DMA transmission Supported baud rate 9600 bit s 19200 bit s 38400 bit s 57600 bit s 115200 bit s default 230400 bit s 460800 bit s and 921600 bit s The 2 wire UART1 is for debugging only Customers sh...

Page 33: ...OL 0 0 45 74 UART0_RTS O UART0 ready for receive VOH 1 35 1 8 2 1 VOL 0 0 45 79 UART0_DTR I UART0 data terminal ready VIH 1 26 1 8 2 1 VIL 0 3 0 63 80 UART0_CTS I UART0 clear to send VIH 1 26 1 8 2 1 VIL 0 3 0 63 75 UART0_DCD O UART0 data carrier detect VOH 1 35 1 8 2 1 VOL 0 0 45 73 UART0_DSR O UART0 data set ready VOH 1 35 1 8 2 1 VOL 0 0 45 3 5 2 Circuit Recommended for the UART Interface Figur...

Page 34: ...RS 232 transceivers must match that of the MU709 module 3 6 USB Interface The MU709 module is compliant with USB 2 0 high speed protocol The USB interface is powered directly from the VBAT supply The USB signal lines are compatible with the USB 2 0 signal specifications Figure 3 13 shows the circuit of the USB interface Table 3 9 Definition of the USB interface Pin No Pin Name Pad Type Description...

Page 35: ...e inductance and radiation In addition avoid signal traces on different layers The USB signal trace must be far away from core logical components because the high current pulse generated during the state transitions process of core components may impose interference on signals The USB signal trace must be far away from board edges with a minimum distance of 20 h h indicates the vertical distance b...

Page 36: ...H 1 26 1 8 2 1 The signal is internally pulled up Keep USIM_DE T floating if it is not used VIL 0 3 0 63 34 USIM_VC C PO Power supply for USIM card 0 3 1 8 1 98 USIM_VC C 1 8 V 0 3 3 0 3 3 USIM_VC C 3 0 V 3 7 2 Circuit Recommended for the USIM Card Interface As the MU709 module is not equipped with a USIM socket you need to place a USIM socket on the user interface board Figure 3 14 shows the circ...

Page 37: ... 37 Figure 3 15 Pin definition of USIM Socket Pin 1 USIM_VCC Pin 2 USIM_RESET Pin 3 USIM_CLK Pin 5 GND Pin 6 VPP Programming Voltage Pin 7 USIM_DATA Pin 9 USIM_DET Figure 3 16 Connections of the USIM_DET pin Module DCE 1 8 V USIM_DET USIM Socket 470 pF CD 1 kΩ CD is a pin detecting USIM card in the USIM socket If the USIM card is present USIM_DET pin should be high and the CD is open ...

Page 38: ... larger capacitance such as 4 7 μF can be employed if necessary Three 33 pF capacitors are placed between the USIM_DATA and Ground pins the USIM_RESET and Ground pins and the USIM_CLK and Ground pins in parallel to filter interference from RF signals It is recommended to take electrostatic discharge ESD protection measures near the USIM socket The TVS diode with Vrwm of 5 V and junction capacitanc...

Page 39: ...Typ V Max V Comments VOL 0 0 45 8 PCM_CLK O PCM clock VOH 1 35 1 80 2 10 The pin is output when the module is used as PCM master input when the module is used as PCM slave VOL 0 0 45 The MU709 PCM interface enables communication with an external codec to support linear format Figure 3 17 Circuit diagram of the interface of the PCM MU709 is used as PCM master Figure 3 18 Circuit diagram of the inte...

Page 40: ...ries HSPA Module AT Command Interface Specification Table 3 12 Signals on the GPIO interface Pin No Pin Name Pad Type Description Parameter Min V Typ V Max V Comments 55 GPIO5 USIM Switch I O General Purpose I O pins Default or USIM Switch control signal VOH 1 35 1 8 2 1 The function of this pin can be defined as GPIO or USIM Switch while the USIM Switch should be enabled by AT command VOL 0 0 45 ...

Page 41: ...JTAG_TMS I JTAG test mode select VIH 1 26 1 8 2 1 VIL 0 3 0 63 36 JTAG_TRST_N I JTAG reset VIH 1 26 1 8 2 1 VIL 0 3 0 63 42 JTAG_TCK I JTAG clock input VIH 1 26 1 8 2 1 VIL 0 3 0 63 72 JTAG_TDO O JTAG test data output VOH 1 35 1 8 2 1 VOL 0 0 45 87 JTAG_TDI I JTAG test data input VIH 1 26 1 8 2 1 VIL 0 3 0 63 3 11 RF Antenna Interface The MU709 module provides two antenna pads MAIN_ANT and AUX_ANT...

Page 42: ...on Interfaces Issue 09 2017 12 15 Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 42 Figure 3 19 RF signal trace design about MAIN_ANT for reference the same for AUX_ANT Figure 3 20 RF signal layout design about MAIN_ANT for reference the same for AUX_ANT ...

Page 43: ...F signal tracks must be 50 Ω Generally the impedance depends on the medium factor track width and distance from the floor In order to reflect the rules of design the following figures indicate the complete structure of the microstrip and stripline with an impedance of 50 Ω as well as the reference design for stack Figure 3 21 Complete structure of the microstrip Figure 3 22 Complete structure of t...

Page 44: ...ution is that to carve out the copper area of the second layer that projected by the RF MAIN pad at top layer How many layers should be carved out depend on the PCB permittivity track width and distance from the floor of your own PCB Our target is to make the RF MAIN pad impedance as closer to 50 Ω as possible 3 12 Reserved Interface The module provides some reserved pins All reserved pins cannot ...

Page 45: ...be welded off when necessary then the USB of module is cut off from AP and can be connected to PC to do some analyses POWER_ON_OFF RESIN_N they are some of the most important signals test points should be placed UART1 UART1 is used for printing the log information SD signals SD signals are used for debugging VBAT not only test points should be placed but also a series magnetic bead should be place...

Page 46: ... Design Requirements 4 2 Operating Frequencies Table 4 1 and Table 4 2 show the RF bands supported by MU709 module Table 4 1 RF bands of MU709s 2 Operating Band Tx Rx UMTS Band 1 1920 MHz 1980 MHz 2110 MHz 2170 MHz UMTS Band 8 880 MHz 915 MHz 925 MHz 960 MHz GSM 850 824 MHz 849 MHz 869 MHz 894 MHz GSM 900 880 MHz 915 MHz 925 MHz 960 MHz GSM 1800 1710 MHz 1785 MHz 1805 MHz 1880 MHz GSM 1900 1850 MH...

Page 47: ...ing L08 C014 350 of DRAKA COMTEQ or Rosenberger Cable length 29 cm The compensation for different frequency bands relates to the cable and the test environment The instrument compensation needs to be set according to the actual cable conditions 4 3 2 Test Standards Huawei modules meet 3GPP test standards Each module passes strict tests at the factory and thus the quality of the modules is guarante...

Page 48: ...BER 0 1 WCDMA Band 2 Main RX 110 5 BER 0 1 WCDMA Band 5 Main RX 111 5 BER 0 1 The test values are the average of some test samples 4 4 2 Conducted Transmit Power The conducted transmit power is another indicator that measures the performance of MU709 The conducted transmit power refers to the maximum power that the module tested at the antenna pad can transmit According to the 3GPP protocol the re...

Page 49: ...K 1Tx Slot 26 2 WCDMA Band 1 23 2 1 WCDMA Band 2 23 2 1 WCDMA Band 5 23 4 1 5 1 4 5 Antenna Design Requirements 4 5 1 Antenna Design Indicators Antenna Efficiency Antenna efficiency is the ratio of the input power to the radiated or received power of an antenna The radiated power of an antenna is always lower than the input power due to the following antenna losses return loss material loss and co...

Page 50: ...erformance S21 indicates the isolation between two antennas Isolation For a wireless device with multiple antennas the power of different antennas is coupled with each other Antenna isolation is used to measure the power coupling The power radiated by an antenna might be received by an adjacent antenna which decreases the antenna radiation efficiency and affects the running of other devices To avo...

Page 51: ...value of the complex patterns of the master and diversity antenna It indicates how similar the magnitude and the phase patterns of the two antennas are If two antennas have no similarity the ECC should be zero Actually the less ECC the better diversity performance The following ECC is recommended for MU709 LGA module ECC 0 5 working frequency below 0 96 GHz ECC 0 3 working frequency above 1 4 GHz ...

Page 52: ...to consider how to reduce the effects of interference sources on the module You can take the following measures Use an LCD with optimized performance shield the LCD interference signals shield the signal cable of the board or design filter circuits Huawei is able to make technical suggestions on radio performance improvement of the module 4 5 3 Antenna Requirements The antenna for MU709 module mus...

Page 53: ... on frequency band s provided by the network operator the customer must use the most suitable antenna for that those band s Bandwidth of primary antenna 70 MHz in GSM 850 80 MHz in GSM 900 170 MHz in GSM 1800 140 MHz in GSM 1900 70 MHZ in WCDMA Band 5 140 MHz in WCDMA Band 2 250 MHz in WCDMA Band 1 Bandwidth of secondary antenna 25 MHz in WCDMA Band 5 60 MHz in WCDMA Band 2 60 MHz in WCDMA Band 1 ...

Page 54: ...ute Ratings Operating and Storage Temperatures Power Supply Features Reliability Features EMC and ESD Features 5 2 Absolute Ratings Table 5 1 lists the absolute ratings for the MU709 module Using the MU709 module beyond these conditions may result in permanent damage to the module Table 5 1 Absolute ratings Symbol Specification Min Max Unit VBAT External power voltage 0 3 4 5 V VI Digital input vo...

Page 55: ...09 module works in the range from 40 C to 20 C or 70 C to 85 C NOT all their RF performances comply with 3GPP specifications 5 4 Power Supply Features 5 4 1 Input Power Supply Table 5 3 lists the requirements for input power of the MU709 module Table 5 3 Requirements for input power Parameter Min Typ Max Ripple Unit VBAT 3 3 3 8 4 2 0 1 V Figure 5 1 Power Supply During Burst Emission The VBAT mini...

Page 56: ...A Notes Configuration Typical Power off 30 Normal voltage 3 8 V is ON while power on event is not triggered Table 5 6 Averaged standby DC power consumption Description Bands Test Value Unit mA Notes Configuration Typical Sleep HSPA WCDMA UMTS bands 2 7 Module is powered up DRX cycle 7 1 28s Module is registered on the network USB is in suspend GPRS EDGE GSM bands 2 4 Module is powered up MFRMS 5 1...

Page 57: ...dBm Tx Power 610 23 5dBm Tx Power HSPA Band 1 IMT 2100 230 0 dBm Tx Power 300 10 dBm Tx Power 610 23 5 dBm Tx Power Band 8 900 MHz 230 0 dBm Tx Power 300 10 dBm Tx Power 620 23 5 dBm Tx Power Table 5 8 Averaged Data Transmission DC power consumption of MU709s 6 HSPA WCDMA Description Band Test Value Unit mA Notes Configuration WCDMA Band 1 IMT 2100 192 0 dBm Tx Power 228 10 dBm Tx Power 557 23 5 d...

Page 58: ... 223 10 dBm Tx Power 542 23 5 dBm Tx Power Table 5 9 Averaged DC power consumption of MU709 module GPRS EDGE Description Test Value Units PCL Configuration GPRS 850 270 mA 5 1 Up 1 Down 400 2 Up 1 Down 550 4 Up 1 Down 170 mA 10 1 Up 1 Down 200 2 Up 1 Down 300 4 Up 1 Down GPRS 900 260 mA 5 1 Up 1 Down 370 2 Up 1 Down 520 4 Up 1 Down 160 mA 10 1 Up 1 Down 200 2 Up 1 Down 280 4 Up 1 Down GPRS 1800 22...

Page 59: ...n 250 4 Up 1 Down EDGE 850 220 mA 8 1 Up 1 Down 300 2 Up 1 Down 420 4 Up 1 Down 170 mA 15 1 Up 1 Down 200 2 Up 1 Down 290 4 Up 1 Down EDGE 900 220 mA 8 1 Up 1 Down 290 2 Up 1 Down 420 4 Up 1 Down 170 mA 15 1 Up 1 Down 200 2 Up 1 Down 280 4 Up 1 Down EDGE 1800 200 mA 2 1 Up 1 Down 260 2 Up 1 Down 360 4 Up 1 Down 180 mA 10 1 Up 1 Down 230 2 Up 1 Down 340 4 Up 1 Down EDGE 1900 200 mA 2 1 Up 1 Down 25...

Page 60: ...ction ok Function test ok RF specification ok High temper ature storage Temperature 85º C Operation mode no power no package Test duration 24 h JESD22 A1 03 C 3 pcs group Visual inspection ok Function test ok RF specification ok Low tempera ture operating Temperature 40º C Operation mode working with service connected Test duration 24 h IEC60068 2 1 3 pcs group Visual inspection ok Function test o...

Page 61: ...ower no package Test duration Spraying interval 8 h Exposing period after removing the salty fog environment 16 h JESD22 A1 07 B 3 pcs group Visual inspection ok Function test ok RF specification ok Sine vibration Frequency range 5 Hz to 200 Hz Acceleration 1 Grms Frequency scan rate 0 5 oct min Operation mode working with service connected Test duration 3 axial directions 2 h for each axial direc...

Page 62: ...fication ok High temperature high humidity High temperature 85º C Humidity 85 Operation mode powered on and no working Test duration 168 h 336 h 500 h 1000 h for inspection point JESD22 A1 10 B 50 pcs group Visual inspection ok Function test ok RF specification ok Temperature cycle Non operating High temperature 85º C Low temperature 40º C Temperature change slope 6º C min Operation mode no power ...

Page 63: ...er than T type for TVS Transient Voltage Suppressor An integrated ground plane is necessary for EMC design The following are the requirements of ESD environment control The electrostatic discharge protected area EPA must have an ESD floor whose surface resistance and system resistance are greater than 1 x 104 Ω while less than 1 x 109 Ω The EPA must have a sound ground system without loose ground ...

Page 64: ... nozzle must all be made of ESD materials and be connected to the ground properly check that the friction voltage is less than 100 V Engineers that touch IC chips boards modules and other ESD sensitive components and assemblies must wear ESD wrist straps ESD gloves or ESD finger cots properly Engineers that sit when handling the components must all wear ESD wrist straps Noticeable ESD warning sign...

Page 65: ... module must be stored and sealed properly in vacuum package under a temperature below 40 C and the relative humidity less than 90 in order to ensure the weldability within 12 months 6 3 Moisture Sensitivity The moisture sensitivity is level 3 After unpacking the module must be assembled within 168 hours under the environmental conditions that the temperature is lower than 30 C and the relative hu...

Page 66: ... Co Ltd 66 Moving storing and processing the product must comply with IPC JEDEC J STD 033 6 4 Dimensions and Interfaces Figure 6 1 shows the dimensions in details Figure 6 1 Dimensions Unit mm 6 5 Packaging HUAWEI LGA module uses five layers ESD pallet anti vibration foam and vacuum packing into cartons The tray specification complies with Jedec_Tray_DGuide4 10D ...

Page 67: ...HUAWEI MU709 Series HSPA LGA Module Hardware Guide Mechanical Specifications Issue 09 2017 12 15 Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 67 Figure 6 2 ESD pallet unit mm ...

Page 68: ...Proprietary and Confidential Copyright Huawei Technologies Co Ltd 68 The following figure shows the packaging 6 6 Customer PCB Design 6 6 1 PCB Surface Finish The PCB surface finish recommended is Electroless Nickel Immersion Gold ENIG Organic Solderability Preservative OSP may also be used ENIG preferred ...

Page 69: ...he solder mask must be 100 µm 150 µm larger than the pad that is the single side of the solder mask must be 50 µm 75 µm larger than the pad The specific size depends on the processing capability of the PCB manufacturer 6 6 4 Requirements on PCB Layout To reduce deformation a thickness of at least 1 0 mm is recommended Other devices must be located more than 3 mm 5 mm recommended away from the two ...

Page 70: ...ther through via holes Increase the quantity of the PCB ground planes The ground planes should be as continuous as possible If a fan is deployed place the module at the cold air inlet Use heat sink thermal conductive material and product enclosure to enhance the heat dissipation of the module Use anodized heat sink on the shielding case or the customer PCB on bottom side for optimal heat dissipati...

Page 71: ... side of the customer PCB you should attach the thermal conductive material between the customer PCB and the heat sink as shown in Figure 6 5 and Figure 6 6 Preferably we recommend the heat sink be installed below the bottom side of the customer PCB Use more pin fins to enlarge heat dissipation area Figure 6 5 Adding heat sink to the module for optimal heat dissipation Module PCB Heat sink Conduct...

Page 72: ...ave large solder pads and cannot be soldered manually 6 8 2 Stencil Design It is recommended that the stencil for the LGA module be 0 15 mm in thickness For the stencil design see the following figure Figure 6 7 Recommended stencil design of LGA module unit mm The stencil design has been qualified for HUAWEI motherboard assembly customers can adjust the parameters by their motherboard design and p...

Page 73: ...o Ltd 73 Figure 6 8 Reflow profile 240 300 180 217 165 120 60 0 s C 60s 100s 45s 80s 235 C Tmax 245 C Table 6 2 Reflow parameters Temperature Zone Time Key Parameter Preheat zone 40 C 165 C Heating rate 0 5 C s 2 C s Soak zone 165 C 217 C t1 t2 60s 100s Reflow zone 217 C t3 t4 45s 80s Peak reflow temperature 235 C 245 C Cooling zone Cooling rate 2 C s Slope 5 C s ...

Page 74: ...lder joints simultaneously Pay attention to protect the module PCB neighboring devices and their solder joints against heating or mechanical damages The LGA module has many solder pads and the pads are large Therefore common soldering irons and heat guns cannot be used in the rework Rework must be done using either infrared heating rework stations or hot air rework stations Infrared heating rework...

Page 75: ...sely on the motherboard and ensure the right installation direction of the module and the reliability of the electrical connection with the PCB It is recommended that the module be preheated in order to ensure that the temperature of all parts to be soldered is uniform during the reflow process The solder quickly reflows upon heating so the parts are soldered reliably The solder joints undergo pro...

Page 76: ...I MU709 Series HSPA LGA Module Hardware Guide Mechanical Specifications Issue 09 2017 12 15 Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 76 Figure 6 10 Temperature graph of rework ...

Page 77: ...out This Chapter This chapter gives a general description of certifications of the MU709 module 7 2 Certifications Table 7 1 shows certifications of the MU709 module have been implemented For more demands please contact us for more details about this information Table 7 1 Product Certifications Certification Model name MU709s 2 MU709s 6 CE RoHS CCC GCF WEEE FCC PTCRB Anetel A tick NCC ...

Page 78: ...blems consult your service provider Pacemaker manufacturers recommend that a minimum distance of 15 cm be maintained between the wireless device and a pacemaker to prevent potential interference with the pacemaker If you are using an electronic medical device consult the doctor or device manufacturer to confirm whether the radio wave affects the operation of this device 8 3 Area with Inflammables ...

Page 79: ... the rules and regulations of airline companies When boarding or approaching a plane power off your wireless device Otherwise the radio signal of the wireless device may interfere with the plane control signals 8 6 Safety of Children Do not allow children to use the wireless device without guidance Small and sharp components of the wireless device may cause danger to children or cause suffocation ...

Page 80: ... chemical detergent or powder to clean it Do not leave your wireless device and accessories in a place with a considerably low or high temperature Use only accessories of the wireless device approved by the manufacture Contact the authorized service center for any abnormity of the wireless device or accessories Do not dismantle the wireless device or accessories Otherwise the wireless device and a...

Page 81: ...U709s 6 GSM 900 37 dBm GSM 1800 34 dBm WCDMA 2100 25 7 dBm Software Information Software updates will be released by the manufacturer to fix bugs or enhance functions after the product has been released All software versions released by the manufacturer have been verified and are still compliant with the related rules All RF parameters for example frequency range and output power are not accessibl...

Page 82: ...RT0_DSR UART0_DTR UART0_DCD RESERVED NC NC JTAG_TCK JTAG_TDI JTAG_TDO JTAG_TMS JTAG_TRST_N NC NC RESERVED NC NC NC NC NC NC NC NC NC NC PCM_CLK PCM_DIN PCM_DOUT PCM_SYNC SD_CLK SD_CMD SD_DATA0 SD_DATA1 SD_DATA2 SD_DATA3 USIM_CLK USIM_DATA USIM_RESET USIM_VCC RESERVED RESERVED RESERVED RESERVED UART0_RING NC NC UART0_CTS UART0_RTS UART0_RX UART0_TX UART1_RX UART1_TX USB_DM USB_DP NC VBAT VBAT NC RE...

Page 83: ...Project 8PSK 8 Phase Shift Keying ADC Analog To Digital Converter AMPR Additional Maximum Power Reduction AP Access Point AUX Auxiliary BC Band Class BER Bit Error Rate BLER Block Error Rate BIOS Basic Input Output System CCC China Compulsory Certification CDMA Code Division Multiple Access CE European Conformity CMOS Complementary Metal Oxide Semiconductor CPU Central Processing Unit CS Circuit S...

Page 84: ...Discharge Protected Area ESD Electrostatic Discharge EU European Union EVDO Evolution Data Optimized FCC Federal Communications Commission FDD Frequency Division Duplex GMSK Gaussian Minimum Shift Keying GPIO General Purpose I O GPRS General Packet Radio Service GPS Global Positioning System GSM Global System for Mobile Communication GLONASS GNSS Global Navigation Satellite System HBM Human Body M...

Page 85: ...ding Scheme MPR Maximum Power Reduction MO Mobile Originated MT Mobile Terminated NC Not Connected NTC Negative Temperature Coefficient NSMD Non Solder Mask Defined OC Open Collector PA Power Amplifier PBCCH Packet Broadcast Control Channel PCB Printed Circuit Board PCL Power Control Level PCM Pulse Code Modulation PDU Protocol Data Unit PID Product Identity PMU Power Management Unit PS Packet Swi...

Page 86: ...nology TBD To Be Determined TDD Time Division Duplex TD SCDMA Time Division Synchronous Code Division Multiple Access TIS Total Isotropic Sensitivity TTFF Time to First Fix TVS Transient Voltage Suppressor TX Transmit UART Universal Asynchronous Receiver Transmitter UL Up Link UMTS Universal Mobile Telecommunications System USB Universal Serial Bus USIM Universal Subscriber Identity Module VID Ven...

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