HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide
Mechanical Specifications
Issue 09 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
71
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Conductive material should be as thin as possible.
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The recommended material of the enclosure is metallic materials, especially
you can add pin fin on the enclosure surface.
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If the heat sink is installed above the shielding case, you should attach the
thermal conductive material between the shielding case and the heat sink; if
the heat sink is installed below the bottom side of the customer PCB, you
should attach the thermal conductive material between the customer PCB and
the heat sink, as shown in Figure 6-5 and Figure 6-6 . Preferably, we
recommend the heat sink be installed below the bottom side of the customer
PCB.
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Use more pin fins to enlarge heat dissipation area.
Figure 6-5
Adding heat sink to the module for optimal heat dissipation
Module PCB
Heat sink
Conductive material
Customer PCB
Module PCB
Heat sink
Conductive material
Customer PCB
Shielding case
Shielding case
Figure 6-6
Adding enclosure to enhance the heat dissipation of the module
Module PCB
Heat sink
Conductive material
Customer PCB
Enclosure
Shielding case
Heat sink
Conductive material
Customer PCB
Enclosure
Module PCB
Shielding case
