S7-PRO Maintenance Manual (Basic Version V2.1)
INTERNAL
2012-07-20
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Page 37 of 97
25.
Install the lower decorative cover.
26.
Install the upper decorative cover.
9 Troubleshooting for Common Failures
9.1 Principle
The S7 Pro, customized for home and mobile users, provides high-speed radio interface
(WCDMA, WIFI) for access to the Broadband Metropolitan Area Network (BMAN), and
HDMI to support various multimedia formats. The S7 Pro supports multimedia, games, GPS,
IM, audio, and data communication to provide satisfactory entertainment and communication
services to home and mobile users. The S7 Pro uses a single board to control the device, and
process the graph, image, and baseband signal.
The key components of Mediapad include: processor MSM8260, RF transceiver QTR8615,
PMU PM8058 and PM8901, power management IC MAX8903, WLAN/BT module
BCM4329, and RGB to LVDS 8-bit transceiver.
The MSM8260 is Qualcomm's new generation processor, and mainly includes the following
sub-processors:
Apps processing: two Scorpion cores, with combined L2 (512 kB) cache running at up to 1.2
GHz
Applications DSP: QDSP6 processor (565 MHz)
Modem μP: ARM1136™ + L2 cache (256 kB) at up to 384 MHz
Modem DSP: QDSP4 processor (to 147 MHz)
Resource power manager: ARM7 (54 MHz)
Sensor peripheral subsystem (SPSS): ARM7 (64 MHz)
Characteristics of the chip:
