5
WFS 1545 Operations Manual
1.
OVERVIEW
The
WFS 1545
standard filtration system and the
WFS 1545 6F
variant were specifically engineered
to provide clean, temperature-controlled water for wafer dicing and similar processes. The system
permits re-use of the process water used for dicing or grinding semiconductor wafers.
Although specifically designed for the semiconductor industry the unit can be applied to any process
that requires refrigerated, and filtered water.
The WFS 1545 provides economies in two ways:
•
Significantly reduces water consumption by reconditioning and reusing the water.
•
Eliminates or reduces contaminated or hazardous liquid waste disposal by filtering out
contaminates into a removable cartridge. The cartridge can be dried and the waste material
can then be handled as solid waste.
The WFS1545 system consists of an Internal Circulating Loop and a Process Loop all on a self-
contained skid. The Process Loop includes an off-skid Lift Station typically installed near the process
machinery for collecting used water and returning it back to the WFS1545 skid. The WFS1545
system also includes a two chambered reservoir, chiller unit and two filtration loops.
a.
PROCESS LOOP
The Process Loop recirculates temperature controlled, filtered and cooled water for dicing and
grinding. The process pump draws water from the clean side of the reservoir and pumps it
through two final filters and then to the process machine. The Lift Station collects the water
from the process machine and returns it to the dirty side of the reservoir.
NOTE:
The 6F variant provides three (3) final filters.
