Electronic Component Distributor. Source::Freescale Semiconductor
P.N:MPC8349CZUAGDB Desc:IC MPU POWERQUICC II PRO 672TBGA
Web:http://www.hotenda.cn E-mail:[email protected] Phone:(+86) 075583794354
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13
80
Freescale Semiconductor
System Design Information
2. The e300 core PLL generates the core clock as a slave to the platform clock. The frequency ratio
between the e300 core clock and the platform clock is selected using the e300 PLL ratio
configuration bits as described in
Section 19.2, “Core PLL Configuration.”
21.2
PLL Power Supply Filtering
Each PLL gets power through independent power supply pins (AV
DD
1, AV
DD
2, respectively). The AV
DD
level should always equal to V
DD
, and preferably these voltages are derived directly from V
DD
through a
low frequency filter scheme.
There are a number of ways to provide power reliably to the PLLs, but the recommended solution is to
provide four independent filter circuits as illustrated in
Figure 42
, one to each of the four AV
DD
pins.
Independent filters to each PLL reduce the opportunity to cause noise injection from one PLL to the other.
The circuit filters noise in the PLL resonant frequency range from 500 kHz to 10 MHz. It should be built
with surface mount capacitors with minimum effective series inductance (ESL). Consistent with the
recommendations of Dr. Howard Johnson in
High Speed Digital Design: A Handbook of Black Magic
(Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a single large value
capacitor.
To minimize noise coupled from nearby circuits, each circuit should be placed as closely as possible to the
specific AV
DD
pin being supplied. It should be possible to route directly from the capacitors to the AV
DD
pin, which is on the periphery of package, without the inductance of vias.
Figure 42
shows the PLL power supply filter circuit.
Figure 42. PLL Power Supply Filter Circuit
21.3
Decoupling Recommendations
Due to large address and data buses and high operating frequencies, the MPC8349EA can generate
transient power surges and high frequency noise in its power supply, especially while driving large
capacitive loads. This noise must be prevented from reaching other components in the MPC8349EA
system, and the device itself requires a clean, tightly regulated source of power. Therefore, the system
designer should place at least one decoupling capacitor at each V
DD
, OV
DD
, GV
DD
, and LV
DD
pin of the
device. These capacitors should receive their power from separate V
DD
, OV
DD
, GV
DD
, LV
DD
, and GND
power planes in the PCB, with short traces to minimize inductance. Capacitors can be placed directly under
the device using a standard escape pattern. Others can surround the part.
These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, distribute several bulk storage capacitors around the PCB, feeding the V
DD
, OV
DD
, GV
DD
,
and LV
DD
planes, to enable quick recharging of the smaller chip capacitors. These bulk capacitors should
V
DD
AV
DD
(or L2AV
DD
)
2.2 µF
2.2 µF
GND
Low ESL Surface Mount Capacitors
10
Ω
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