Electronic Component Distributor. Source::Freescale Semiconductor
P.N:MPC8349CZUAGDB Desc:IC MPU POWERQUICC II PRO 672TBGA
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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13
Freescale Semiconductor
17
DDR and DDR2 SDRAM
Table 15
provides the DDR capacitance when
GV
DD
(typ) = 2.5 V.
Table 16
provides the current draw characteristics for MV
REF
.
6.2
DDR and DDR2 SDRAM AC Electrical Characteristics
This section provides the AC electrical characteristics for the DDR and DDR2 SDRAM interface.
6.2.1
DDR and DDR2 SDRAM Input AC Timing Specifications
Table 17
provides the input AC timing specifications for the DDR2 SDRAM when GV
DD
(typ) = 1.8 V.
Table 18
provides the input AC timing specifications for the DDR SDRAM when GV
DD
(typ) = 2.5 V.
Table 15. DDR SDRAM Capacitance for GV
DD
(typ) = 2.5 V
Parameter/Condition
Symbol
Min
Max
Unit
Notes
Input/output capacitance: DQ, DQS
C
IO
6
8
pF
1
Delta input/output capacitance: DQ, DQS
C
DIO
—
0.5
pF
1
Note:
1. This parameter is sampled. GV
DD
= 2.5 V ± 0.125 V, f = 1 MHz, T
A
= 25°C, V
OUT
= GV
DD
/2, V
OUT
(peak-to-peak) = 0.2 V.
Table 16. Current Draw Characteristics for MV
REF
Parameter/Condition Symbol
Min
Max
Unit
Note
Current draw for MV
REF
I
MVREF
—
500
μ
A
1
Note:
1. The voltage regulator for MV
REF
must supply up to 500
μ
A current.
Table 17. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface
At recommended operating conditions with GV
DD
of 1.8 ± 5%.
Parameter
Symbol
Min
Max
Unit
Notes
AC input low voltage
V
IL
—
MV
REF
– 0.25
V
—
AC input high voltage
V
IH
MV
REF
+ 0.25
—
V
—
Table 18. DDR SDRAM Input AC Timing Specifications for 2.5-V Interface
At recommended operating conditions with GV
DD
of 2.5 ± 5%.
Parameter
Symbol
Min
Max
Unit
Notes
AC input low voltage
V
IL
—
MV
REF
– 0.31
V
—
AC input high voltage
V
IH
MV
REF
+ 0.31
—
V
—
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