HAKO 474, Instruction Manual

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6
Wipe away any oxide or old solder
from the nozzle using the hole in
the center of the sponge.
2. Clean the tip of the nozzle.
• Keep the solder-plated section of
the nozzle a shiny white by coating
it with a small amount of solder.
If the tip of the nozzle is coated with
oxide, the nozzle’s heat conductivity
will be lowered.
Coating the tip with a small amount
of fresh solder ensure maximum heat
conductivity.
3. Melt the solder.
• Apply the nozzle to the soldered
part and melt the solder.
CAUTION
Never allow the nozzle to touch the
board itself.
• Confirm that the solder is melted.
CAUTION
To confirm that all solder is melted,
observe the inside of the hole and the
backside of the P.W.B. If this is difficult
to do, try slowly moving the lead with
the nozzle – If the lead moves, the
solder is melted.
CAUTION
Never move the lead by force. If it
doesn’t move easily, the solder isn’t yet
fully melted.
4. Absorb the solder.
• After confirming that the solder is
completely melted, absorb the sol-
der by squeezing the trigger on the
gun.
CAUTION
Never leave any solder remaining
inside the hole in the P.W.B.
• After fully absorbing all the solder,
cool the soldering junction in order
to prevent it from becoming resol-
dered.
5. Problems during desolder-
ing.
• If solder remains, resolder the com-
ponent and repeat the desoldering
process.
Nozzle
P.W.B.
Solder
Lead
Slowly move
the lead with
the nozzle.
Absorb the solder by slowly
moving the lead back and
forth with the tip of the
nozzle.
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