READ CAREFULLY BEFORE USING THIS
MANUAL
Introduction
This machine is a dicing saw for cutting silicon wafers and glass circuit boards
(workpieces, hereafter).
It has the rotary sections which rotate at high speed, the high-voltage sections
which may cause electric shock hazards and the drive sections which may
catch the operator's body and clothing.
If the machine is not properly operated, safety hazards may cause serious
injury or death.
Read before using the machine
Before using the machine, thoroughly read this manual and follow the
instructions set forth in this manual.
To assure safety in the operation and maintenance of the machine, it is
important that you know the location of potential safety hazards. It is difficult
for DISCO to foresee each and every potential safety hazard. However, this
manual carries various precautionary notes and warnings to indicate the
presence of all foreseeable potential safety hazards. For increased safety
assurance, it is therefore essential that you observe all the precautions and
other relevant instructions set forth in this manual.
If you modify the machine without prior consent of DISCO or repair it in a
manner not stated in this manual, the safety assurance features of the machine
may be seriously affected.
Never attempt to modify or repair the machine in a manner not approved by
DISCO.
Sample
