Diamond Systems ELTON ELT-BB01, User Manual

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Elton User Manual Rev 1.04 www.diamondsystems.com Page 54
15. THERMAL SOLUTIONS
The Elton baseboard implements an optimized Thermal Management System to ensure that the baseboard
and components are maintained at their maximum specified temperatures. Applying a thermal management
component below recommended standards will produce undesirable consequences.
The baseboard is designed to operate at a temperature range of-40°C to +85°C, while the AGX Xavier Series
Module operates at a temperature range of -25°C to +80°C. To ensure compatibility and circumvent the
difference in operating temperatures, the AGX Xavier Series Module integrates a Product-Level Thermal
Transfer Plate (TTP) as a Thermal Solution which can accommodate the following solutions:

Passive Heat Sink

Active Heat Sink

Cold Plate

Chassis Mount or similar component
The Thermal Solution to be implemented interfaces the NVIDIA TTP. To ensure proper implementation, Customers
are required to follow the specified standards stated in
NVIDIA’s
JETSON AGX XAVIER Thermal Design Guide before
implementing thermal solutions for the AGX Xavier Series Module and module-specific Thermal Transfer Plate (TTP).
NOTE : The user must be logged in to the developer.nvidia.com site to access the JETSON AGX XAVIER
Thermal Design Guide .
The Thermal Solution must be attached to the top surface of the TTP. However, based on the chassis design,
many configurations are possible. For typical scenarios the following recommendations are applicable:

The contact of the thermal solution must be well administered on the TTP.

NVIDIA thermal testing has demonstrated that the maximum specified TTP temperature controls the
temperature range of all components on the baseboard.
To determine the best method to interface the TTP with the respective Thermal Solution and ensure thermal,
mechanical and qualification compatibility at the system-level, ref
er to NVIDIA’s
JETSON AGX XAVIER
Thermal Design Guide mentioned above for details on specifications.
The following table provides the specifications for the AGX Xavier Series Module.
Parameter
30 W Mode 1 MaxN Mode 2
Unit
Maximum TTP Operating Temperature
3
80 80
°C
Recommended Xavier Module
Operating Temperature Limit
4
T.cpu = 90.0 T.cpu = 86.0 °C
T.gpu = 92.5 T.gpu = 88.0 °C
T.aux = 89.0 T.aux = 82.0 °C
Xavier Module Maximum Operating
Temperature Limit
5
T.cpu = 95.5 T.cpu = 91.5 °C
T.gpu = 98.0 T.gpu = 93.0 °C
T.aux = 94.5 T.aux = 87.5 °C
1
The Power Management for Jetson AGX Xavier document describes multiple power modes: a 10 W, a 15 W, and several 30 W modes. The
same temperature settings apply to all of these power modes that are within the 30 W module power budget.
2
The MaxN power mode allows for higher operating power levels. These higher power modes require lower temperature limits to maintain the
reliability of Jetson AGX Xavier.
3
The temperature of the TTP must always be kept within this 80 °C limit to maintain the specified performance and reliability. The
measurement locations are provided in Figure 3-2 of the JETSON AGX XAVIER Thermal Design Guide.
4
These are the temperature thresholds below which the product will operate at the specified clock speeds. See Section 4.3 of the JETSON
AGX XAVIER Thermal Design Guide.
5
The Xavier SoC will reset the Jetson AGX Xavier Module once any of these software-imposed temperature limits are reached to maintain the
reliability of the Xavier SoC. See Section 4.5 of the JETSON AGX XAVIER Thermal Design Guide.