7
Publication No. 1637/ UPDATE
07.19
Mat-No. 3003103
Note:
The complete component portfolio can be found in our condensed main catalogue.
3. Contacting the conductor end
The connection element can be both connected to the connecting plate of the supporting tube and to the
air-termination system/roof parapet.
The
HVI
light Conductor
must be cut to the required conductor length on site and must be prepared for
contact with the connection element according to Fig. 2, page 8.
The
HVI
cutter
(Part No. 597 632) can be used to cut the
HVI
light Conductor
to length and to remove
the sheath. The entire sheath must be shortened by 35 mm. The dark grey sheath of the
HVI
light Conductor
must be shortened by another 15 mm so that the semiconducting black sheath underneath it can be contacted
(Fig. 2, page 8). This black sheath must not be damaged.
The
HVI
strip
20 tool (Part No. 597 220) allows to easily and reliably strip the outer sheath and the PE
insulation without damaging the copper conductor underneath the black sheath.
The connection element must be rotated to insert the
HVI
light Conductor
into the connection element.
The two threaded pins (tightening torque of
5 Nm
) allow safe electrical contact. Finally, a heat-shrinkable
sleeve is applied (see Fig. 2 on the right, page 8).
After mounting the head piece/connection element to the
HVI
light Conductor
, a heat shrinkable sleeve
must be wrapped around the relevant mounting areas to protect them from mechanical, environmental or
chemical influences. The connection set includes two heat shrinkable sleeves.
The following must be observed when wrapping a heat shrinkable sleeve around the head
piece/connection element:
The indicated shrinking area between the head piece/connection element and the
HVI
light
Conductor
must be observed (Fig. 2, page 8).
The heat shrinkable sleeve is applied between the front shrinking area of the relevant head
piece/
connection element and the
HVI
light Conductor
. The heat shrinkable sleeves must flush
with
the shrinking area. If required, they must be repositioned during the shrinking on process.
The specified shrinking temperature of max. 150 °C must be observed!
The shrinking temperatures in the shrinking area of the
HVI
light Conductor
must not be too
high. In case of excessive shrinking temperatures, the semiconductive sheath of the
HVI
light
Conductor
can be damaged or destroyed and the function of the
HVI
light Conductor
may not
be ensured any more. In case of low ambient/component temperatures, the shrinking time must be
increased to ensure that the heat shrinkable sleeve is correctly applied (emission of adhesive).
The heat shrinkable sleeve must not trap air or form bubbles.
