HPF9000-OM (V1.8)
HPF-9000 PRODUCT MANUAL
1-7
Introduction
HPF-9000 Functional Description
Figure 1-4 Frame Capacity for Various Rear I/O Module Types (Cont.)
Expansion Rear Module
(Fusion3G
®
only)
An Expansion Rear Module is used in conjunction with a Fusion3G
®
card
equipped to provide optional connections such as analog audio I/O (which is in turn
provided by an Expansion piggyback card factory-installed on the base card when
this option is ordered). Expansion Rear Modules are identified with “X” in the part
number and must be used in conjunction with a Base Rear Module.
The expansion rear module installs directly to the left of the base Rear Module (as
shown viewed from rear), and interfaces with the piggyback card. Base rear
modules fit even slots, with expansion rear module fitting in next even slot to
the left unless noted otherwise (e.g., base in slot 2; expansion in slot 4).
The Fusion3G
®
base/piggyback card assembly occupies the space identical to that
of two regular Fusion3G
®
cards using two standard-width rear modules.
Note: In all cases, maximum frame power budget of 360W for user slot total must
be considered when planning frame build-out. If necessary, consult Cobalt
Sales for assistance in power planning.
Fusion3G base card
and Rear Module
Fusion3G piggyback
card and Expansion
Rear Module
1 card assembly per base/expansion
rear module combination
4 card slots used
5 card assemblies per frame (max)
5 base/expansion rear modules per frame (max)
RM20-9901-B Rear Module
provides connection break-out
for base card functions.
Expansion Rear Module installs
directly to the left of base Rear
Module, and interfaces with the
piggyback card. In this example, an
RM20-9901-XC expansion rear
module breaks out analog audio
connections provided by Option
+ANA (analog audio option).
High Ventilation (HV) Rear Module occupies 2 card slots and offers
coaxial connections using miniaturized connectors (HDBNC or DIN 1.0/
2.3). These rear modules have openings to increase ventilation where
the normal recommended above-frame ventilation space (1 RU) cannot
be accommodated.
Notes: • HV (high-ventilation) rear modules are available only for
certain Cobalt cards. Consult our catalog, card Product
Manual, or our website for availability of high-ventilation rear
modules for particular cards. This rear module fits even
slots unless noted otherwise.
• (Fusion3G
®
only) Where a base HV rear module is to be used
in conjunction with an expansion rear module, a companion
HV expansion rear module must also be used. Both base
and expansion HV rear modules use card positioning that
optimizes air flow across the component surface of the card
PCB. Also note that when using an expansion rear module,
frame capacity then follows the form as specified in
“Expansion Rear Module” above.
• In all cases, maximum frame power budget of 360W for user
slot total must be considered when planning frame build-out. If
necessary, consult Cobalt Sales for assistance in power
planning.
High-Ventilation Rear Module
1 card per rear module
2 card slots used
10 cards per frame (max)
10 rear modules per frame (max)
Ventilation openings allow increased ventilation in
installations where normal above-frame ventilation
clearance is reduced
b
as
e
ex
p
20
rear of frame
1
20
rear of frame
1
