EES3 Hardware Interface Description
6.2 Mounting EES3 onto the Application Platform
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Confidential / Released
6.2.4
Durability and Mechanical Handling
6.2.4.1
Storage Life
EES3 modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier
anti-static bags. The shelf life in a sealed moisture bag is an estimated 12 month. However, such
a life span requires a non-condensing atmospheric environment, ambient temperatures below
40°C and a relative humidity below 90%. Additional storage conditions are listed in
6.2.4.2
Processing Life
EES3 must be soldered to an application within 72 hours after opening the MBB (=moisture
barrier bag) it was stored in.
As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the
modules should have ambient temperatures below 30°C and a relative humidity below 60%.
6.2.4.3
Baking
Baking conditions are specified on the moisture sensitivity label attached to each MBB (see
for details):
•
It is
not necessary
to bake EES3, if the conditions specified in
and
were not exceeded.
•
It is
necessary
to bake EES3, if any condition specified in
and
If baking is necessary, the modules must be put into trays that can be baked to at least 125°C.
Devices should not be baked in tape and reel carriers at any temperature.
6.2.4.4
Electrostatic Discharge
ESD (=electrostatic discharge) may lead to irreversable damage for the module. It is therefore
advisable to develop measures and methods to counter ESD and to use these to control the
electrostatic environment at manufacturing sites.
Please refer to
for further information on electrostatic discharge.
