Version 5.8
11
June 2009
Installation Manual
2. Installing the Device
2
Installing the Device
This section describes the device's hardware installation, which includes the following:
Physical description of the device (refer to 'Installing the Device' on page
11
)
List of shipped items (refer to 'Unpacking Package Contents' on page
14
)
Mounting the device (refer to 'Mounting the Device' on page
15
)
Cabling the device (refer to 'Cabling the Device' on page
17
)
Caution Electrical Shock
The equipment must only be installed or serviced by qualified service
personnel.
2.1
Physical Description
This section provides a physical description of the device's front (refer to 'Front Panel' on
page
11
) and rear panels (refer to 'Rear Panel' on page
14
).
The device is designed with a 19-inch industrial platform chassis, 1U high and 13.8 inch
deep. The device supports a scalable, modular architecture that includes the following
replaceable modules:
Up to six analog (
FXS
and/or
FXO
) modules (applicable only to SIP)
Up to four E1/T1
TRUNKS
modules
Up to five
BRI
modules (applicable only to SIP)
Up to three
MPM
modules (media processing module)
OSN1
or
OSN2
Server modules (optional)
One
CPU
module
One
Fan Tray
module
One
Power Supply
module
Summary of Contents for Mediant 1000
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