ZYNQ FPGA Development Board AX7350B User Manual
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Configure chip pin assignments:
Signal Name
ZYNQ Pin Name
ZYNQ Pin Number
QSPI_SCK
PS_MIO6_500
F23
QSPI_CS
PS_MIO1_500
D26
QSPI_D0
PS_MIO2_500
E25
QSPI_D1
PS_MIO3_500
D25
QSPI_D2
PS_MIO4_500
F24
QSPI_D3
PS_MIO5_500
C26
Part 5
：
eMMC Flash
The AX7350B FPGA development board is equipped with a
large-capacity 8GB eMMC FLASH chip, model THGBMFG6C1LBAIL, which
supports the JEDEC e-MMC V5.0 standard HS-MMC interface with level
support of 1.8V or 3.3V. The data width of the eMMC FLASH and ZYNQ
connections is 4 bits. Due to the large capacity and non-volatile nature of
eMMC FLASH, it can be used as a large-capacity storage device for the ZYNQ
system, such as ARM applications, system files and other user data files. The
specific models and related parameters of eMMC FLASH are shown in Table
5-1.
Position
Model
Capacity
Factory
U11
THGBMFG6C1LBAIL
8G Byte
TOSHIBA
Table 5-1: eMMC FLASH Specification
eMMC FLASH is connected to the GPIO port of the BANK501 in the PS
section of the ZYNQ chip. In the system design, the GPIO port functions of
these PS ports need to be configured as the SD interface. Figure 5-1 shows the
eMMC Flash in the schematic.