ADLINK Technology CoreModule 730, Reference Manual

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CoreModule 730 Reference Manual 3
Chapter 2 Product Overview
This introduction presents general information about the Stackable architecture and the CoreModule 730
single board computer (SBC). After reading this chapter you should understand:
•
Stackable architecture
•
CoreModule 730 product description
•
CoreModule 730 features
•
Major components
•
Header, Connector, Socket definitions
•
Specifications
Stackable Architecture
Stackable architecture affords a great deal of flexibility in system design. You can build a simple system
using only a CoreModule single board computer (SBC) and a Compact Flash card in the Compact Flash
socket. To expand a simple CoreModule system, simply add self-stacking ADLINK MiniModule products
or 3rd party stackable expansion boards to provide additional capabilities, such as:
•
Additional I/O ports
•
Analog or digital I/O interfaces
Stackable expansion modules can be stacked with the CoreModule 730 avoiding the need for card cages and
backplanes. The stackable expansion modules can be mounted directly to the SUMIT connector of the
CoreModule 730. SUMIT-compliant modules can be stacked with an inter-board spacing of ~0.60" (15mm)
so that a 3-module system fits in a 3.6" x 3.8" x 2.4" space. See Figure 2-1 .
One or more MiniModule products or other stackable modules can be installed on the CoreModule
expansion connectors. When installed on the SUMIT connectors, the expansion modules fit within the
CoreModule outline dimensions. Most MiniModule products have stack-through connectors compatible
with the SUMIT Version 1.0 specification. Several modules can be stacked on the CoreModule headers.
Each additional module increases the thickness of the package by 0.60" (15mm). See Figure 2-1 .
Figure 2-1. Stacking Modules with the CoreModule 730
0.6 inch spacer (8)
4-40 nut (4)
4-40 screw (4)
Stackable Expansion
Modules
Stack-Through
SUMIT Connectors
CoreModule 730