16
Chapter 1
CPU Fan True Value Table
Throttling 50%: On= 90°C; OFF=80°C
OS shut down at 95°C; H/W shut down at 85°C
North Bridge Specifications
South Bridge Specifications
System Memory
CPU Temperature
(Celsius)
Fan Speed (RPM)
SPL Spec (dBA)
38
2400
23
43
3300
26
50
4000
29
56
4500
31
Item
Specification
Chipset
Intel Crestline GS45 SFF
Package
FCBGA 1363 balls
Features
•
Processor hosts bus supports 667/800/1066MHz FSB support.
•
Supports Dual Channel DDR2 SDRAM at 667/800MHz
•
Integrated SDRAM controller up to 8GB (2 SODIMM support)
•
DMI x2 and DMI x4 for connection between GMCH and ICH9M
Item
Specification
Chipset
ICH9M SFF
Package
BGA 676 balls
Features
•
Upstream accelerated Hub architecture interface for access to
GMCH.
•
PCI Express Base Specification, Revision 1.1 support.
•
PCI 2.3 interface. (4 PCI Request/Grant pairs).
•
ACPI Power Management Logi Support.
•
Enhanced DMA controller, interrupt controller, timers functions.
•
Integrated Serial ATA host controllers with independent DMA
operation on six ports and AHCI support.
•
USB 1.1 and USB 2.0 Host controllers.
•
Supports Intel High Definition Audio (Intel HD Audio) Interface.
•
Supports Intel® Matrix Storage Technology.
•
Supports Intel® Active Management Technology.
•
Low Pin Count (LPC) interface.
•
6 PCle ports.
Item
Specification
Memory size
0MB (No on-board Memory)
DIMM socket number
2 sockets
Supports memory size per socket
2GB
Supports maximum memory size
4GB for 64bit OS (with two 2GB SO-DIMM)
Supports DIMM type
DDR2 Synchronous DRAM
Supports DIMM Speed
800/667 MHz
Summary of Contents for ASPIRE ONE 1410
Page 6: ...VI...
Page 10: ...X Table of Contents...
Page 34: ...24 Chapter 1...
Page 50: ...40 Chapter 2...
Page 59: ...Chapter 3 49 9 Detach the HDD board...
Page 61: ...Chapter 3 51 5 Pull the memory module out 6 Repeat steps 4 and 5 for the second memory module...
Page 73: ...Chapter 3 63 7 Unlock the touch pad FCC and pull the cable away...
Page 77: ...Chapter 3 67 4 Lift off the LCD Board 5 Unlock and remove the LED board FCC from the mainboard...
Page 87: ...Chapter 3 77 4 Pull the cables away from the two adhesive locations 5 Lift the modules away...
Page 91: ...Chapter 3 81 5 Roll the bezel up and away from the hinges...
Page 94: ...84 Chapter 3 4 Lift the LCD panel out lifting the bottom of the panel first...
Page 106: ...96 Chapter 3 3 Apply adhesive and stick the microphone down...
Page 117: ...Chapter 3 107 3 Connect the speaker connector...
Page 135: ...Chapter 3 125 4 Tighten the four captive screws...
Page 137: ...Chapter 3 127 4 Place the HDD cover in from one corner 5 Tighten the two captive screws...
Page 140: ...130 Chapter 3...
Page 240: ...230 Appendix A...
Page 250: ...240 Appendix B...
Page 252: ...242...
Page 255: ...245...
Page 256: ...246...