Publication No. SBC329-HRM/1
Thermal Derating 129
B.2 Processor Option 3: Low Power
Product codes are of the form SBC329-y3
xxxxxxx, where “y” is the build level and
“
3
” selects the
low-power processor (1505L, 25W). See the
details of the other options.
Table B-2 Maximum Processor Speed versus Maximum Temperature for Processor Option 3
Build
Level
(y)
Maximum CPU Rating at
Maximum Operating Temperature
Maximum Operating Temperature
at Maximum CPU Rating
Heat
Dissipation
Method
Temperature
Frequency
Frequency
Temperature
1
55
˚C
TBD GHz
2.2
GHz
TBD
˚C
300 lfm blown air
2
65
˚C
TBD GHz
2.2
GHz
TBD
˚C
3
75
˚C
TBD GHz
2.2
GHz
TBD
˚C
600 lfm blown air
4
75
˚C
TBD GHz
2.2
GHz
TBD
˚C
Card edge
5
85
˚C
TBD GHz
2.2
GHz
TBD
˚C
NOTES
The thermal data for the above table was determined while the units were running multi-
threaded test software used to stress CPU, memory and I/O functions simultaneously. This test
load is generally heavier than a standard embedded application. There may be some variance in
users’ thermal results based on the end application.
No XMCs were fitted to the units used in determining the above figures. Fitting an XMC could
decrease the maximum frequency/temperature achievable by the SBC329, depending on the
XMC’s power dissipation and thermal solution.
The processor speed can be fixed in the BIOS. See
