Ublox SARA-N210, Руководство по системной интеграции

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SARA-N2 series - System Integration Manual
UBX-17005143 - R06 Design-in Page 51 of 82
2.10 Module footprint and paste mask
Figure 30 and Table 24 describe the suggested footprint (i.e. copper mask) and paste mask layout for
SARA modules: the proposed land pattern layout reflects the modules’ pins layout, while the proposed
stencil apertures layout is slightly different (see the F’’, H’’, I’’, J’’, O’’ parameters compared to the F’,
H’, I’, J’, O’ ones).
The Non Solder Mask Defined (NSMD) pad type is recommended over the Solder Mask Defined (SMD)
pad type, implementing the solder mask opening 50
µ
m larger per side than the corresponding copper
pad.
The recommended solder paste thickness is 150
µ
m, according to application production process
requirements.
K
M1
M1
M2
E G H’ J’ E
ANT pin
B
Pin 1
K
G
H’
J’
A
D
D
O’
O’
L N L
I’
F’
F’
K
M1
M1
M2
E G H’’ J’’ E
ANT pin
B
Pin 1
K
G
H’’
J’’
A
D
D
O’’
O’’
L N L
I’’
F’’
F’’
Stencil: 150
µ
m
Figure 30: SARA-N2 series modules suggested footprint and paste mask (application board top view)
Parameter Value Parameter Value Parameter Value
A 26.0 mm G 1.10 mm K 2.75 mm
B 16.0 mm H’ 0.80 mm L 2.75 mm
C 3.00 mm H’’ 0.75 mm M1 1.80 mm
D 2.00 mm I’ 1.50 mm M2 3.60 mm
E 2.50 mm I’’ 1.55 mm N 2.10 mm
F’ 1.05 mm J’ 0.30 mm O’ 1.10 mm
F’’ 1.00 mm J’’ 0.35 mm O’’ 1.05 mm
Table 24: SARA-N2 series modules suggested footprint and paste mask dimensions
☞
These are recommendations only and not specifications. The exact copper, solder and paste mask
geometries, distances, stencil thicknesses and solder paste volumes must be adapted to the
specific production processes (e.g. soldering etc.) of the customer.