SARA-N2 series - System Integration Manual
UBX-17005143 - R06
Design-in
Page 35 of 82
provide two examples of proper 50
coplanar waveguide designs. The first
transmission line can be implemented in case of 4-layer PCB stack-up herein described, the second
transmission line can be implemented in case of 2-layer PCB stack-up herein described.
35
µ
m
35
µ
m
35
µ
m
35
µ
m
270
µ
m
270
µ
m
760
µ
m
L1 Copper
L3 Copper
L2 Copper
L4 Copper
FR-4 dielectric
FR-4 dielectric
FR-4 dielectric
380
µ
m 500
µ
m
500
µ
m
Figure 16: Example of 50
coplanar waveguide transmission line design for the described 4-layer board layup
35
µ
m
35
µ
m
1510
µ
m
L2 Copper
L1 Copper
FR-4 dielectric
1200
µ
m 400
µ
m
400
µ
m
Figure 17: Example of 50
coplanar waveguide transmission line design for the described 2-layer board layup
If the two examples do not match the application PCB layup, the 50
characteristic impedance
calculation can be made using the HFSS commercial finite element method solver for
electromagnetic structures from Ansys Corporation, or using freeware tools like AppCAD from
Agilent (
) or TXLine from Applied Wave Research (
), taking care
of the approximation formulas used by the tools for the impedance computation.
To achieve a 50
characteristic impedance, the width of the transmission line must be chosen
depending on:
the thickness of the transmission line itself (e.g. 35
µ
m in the example of
the thickness of the dielectric material between the top layer (where the transmission line is
routed) and the inner closer layer implementing the ground plane (e.g. 270
µ
m in
, 1510
µ
m
in
the dielectric constant of the dielectric material (e.g. dielectric constant of the FR-4 dielectric
material in
the gap from the transmission line to the adjacent ground plane on the same layer of the
transmission line (e.g. 500
µ
m in
, 400
µ
m in
If the distance between the transmission line and the adjacent GND area (on the same layer) does not
exceed 5 times the track width of the micro strip, use the “Coplanar Waveguide” model for the 50
calculation.