LISA-U2 series - System integration manual
UBX-13001118 - R27
Handling and soldering
Page 162 of 183
C1-Public
4.2.8
Rework
The LISA-U2 modules can be unsoldered from the baseboard using a hot air gun.
⚠
Avoid overheating the module.
After the module is removed, clean the pads before placing.
⚠
Never attempt a rework on the module itself, e.g. replacing individual components. Such actions
immediately terminate the warranty.
4.2.9
Conformal coating
Certain applications employ a conformal coating of the PCB using HumiSeal
®
or other related coating
products.
These materials affect the HF properties of the LISA-U2 modules and it is important to prevent them
from flowing into the module.
The RF shields do not provide 100% protection for the module from coating liquids with low viscosity,
so care is required in applying the coating.
☞
Conformal coating of the module will void the warranty.
4.2.10
Casting
If casting is required, use viscose or another type of silicone-pottant. The OEM is strongly advised to
qualify such processes in combination with the LISA-U2 modules before implementing this in
production.
☞
Casting will void the warranty.
4.2.11
Grounding metal covers
Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips
directly onto the EMI covers is done at the customer's own risk. The numerous ground pins should be
sufficient to provide optimum immunity to interferences and noise.
☞
u-blox gives no warranty for damages to the LISA-U2 modules caused by soldering metal cables
or any other forms of metal strips directly onto the EMI covers.
4.2.12
Use of ultrasonic processes
LISA-U2 modules contain components which are sensitive to ultrasonic waves. Use of any ultrasonic
processes (cleaning, welding etc.) may cause damage to the module.
☞
u-blox gives no warranty against damages to the LISA-U2 modules caused by any ultrasonic
processes.