LISA-U2 series - System integration manual
UBX-13001118 - R27
System description
Page 97 of 183
C1-Public
53
I2S1_CLK
54
I2S1_WA
R2
R1
BCLK
GND
U1
LRCLK
LISA-U2 series
Audio
Codec
40
I2S1_TXD
39
I2S1_RXD
SDIN
SDOUT
46
SDA
45
SCL
SDA
SCL
52
CODEC_CLK
MCLK
GND
IRQn
R3
C3
C2
C1
4
V_INT
VDD
1V8
MICBIAS
C4
R4
C5
C6
EMI1
MICLN
MICLP
D1
Microphone
Connector
EMI2
MIC
C12 C11
J1
MICGND
R5
C8 C7
D2
SPK
Speaker
Connector
OUTP
OUTN
J2
C10 C9
C14 C13
EMI
3
EMI
4
Figure 50: I2S interface application circuit with an external audio codec to provide voice capability
Reference
Description
Part Number
–
Manufacturer
C1
100 nF Capacitor Ceramic X5R 0402 10% 10V GRM155R71C104KA01
–
Murata
C2, C4, C5, C6
1 µF Capacitor Ceramic X5R 0402 10% 6.3 V
GRM155R60J105KE19
–
Murata
C3
10 µF Capacitor Ceramic X5R 0603 20% 6.3 V
GRM188R60J106ME47
–
Murata
C7, C8, C9, C10
27 pF Capacitor Ceramic COG 0402 5% 25 V
GRM1555C1H270JZ01
–
Murata
C11, C12, C13, C14 10 nF Capacitor Ceramic X5R 0402 10% 50V
GRM155R71C103KA88
–
Murata
D1, D2
Low Capacitance ESD Protection
USB0002RP or USB0002DP
–
AVX
EMI1, EMI2, EMI3,
EMI4
Chip Ferrite Bead Noise/EMI Suppression Filter
1800 Ohm at 100 MHz, 2700 Ohm at 1 GHz
BLM15HD182SN1
–
Murata
J1
Microphone Connector
Various manufacturers
J2
Speaker Connector
Various manufacturers
MIC
2.2 k
Electret Microphone
Various manufacturers
R1, R2
4.7 k
Ω
Resistor 0402 5% 0.1 W
RC0402JR-074K7L - Yageo Phycomp
R3
10 k
Ω
Resistor 0402 5% 0.1 W
RC0402JR-0710KL - Yageo Phycomp
R4, R5
2.2 k
Ω
Resistor 0402 5% 0.1 W
RC0402JR-072K2L
–
Yageo Phycomp
SPK
32
Speaker
Various manufacturers
U1
16-Bit Mono Audio Voice Codec
MAX - Maxim
Table 41: Example of components for audio voice codec application circuit
☞
Any external signal connected to the digital audio interface must be tri-stated or set low when the
module is in power-down mode and during the module power-on sequence (at least until the
activation of the
V_INT
supply output of the module), to avoid latch-up of circuits and allow a
proper boot of the module. If the external signals connected to the cellular module cannot be tri-
stated or set low, insert a multi-channel digital switch (e.g. Texas Instruments SN74CB3Q16244,
TS5A3159, or TS5A63157) between the two-circuit connections and set it to high impedance
during the module power-down mode and during the module power-on sequence.
☞
If the I2S digital audio pins are not used, they can be left unconnected on the application board.