ODIN-W2 series - System Integration Manual
UBX-14040040 - R03
Advance Information
System description
Page 13 of 33
The following two types of ground (GND) pads are available:
•
GND pads and the PCB edge (castellations): Mainly for power supply return path and RF ground.
•
Heat dissipation GND pads under the module: Mainly used for dissipation of heat, especially during
intensive Wi-Fi activity.
See the Module footprint and paste mask and Thermal guidelines sections for information about ground design.
