ODIN-W2 series - System Integration Manual
UBX-14040040 - R03
Advance Information
Design-in
Page 16 of 33
positioned along one side of the host PCB ground plane is the second best option. It is beneficial to have a large
ground plane on the host PCB and have a good grounding on the ODIN- W2 module.
Figure 5: ODIN-W262 internal antenna
2.3
Module placement
An optimized module placement allows better RF performance. See Antenna interfaces section for more
information on antenna consideration during module placement.
Ensure that the module is clearly separated from any possible source of radiated energy. In particular, digital
circuits can radiate digital frequency harmonics, which can produce electromagnetic interference that affects the
module, analog parts and performance of RF circuits.
The heat dissipation during continuous transmission at maximum power can significantly raise the
temperature of the application baseboard below the ODIN-W2 series modules; Hence, avoid placing
temperature sensitive devices close to the module.
2.4
Module footprint and paste mask
Figure 6 describes the suggested footprint (that is, copper mask) layout for the ODIN-W2 series modules. The
proposed land pattern layout reflects the pads layout of the modules and extends 0.2 mm outside the module
outline.
The Non Solder Mask Defined (NSMD) pad type is recommended over the Solder Mask Defined (SMD) pad type,
which implements the solder mask opening 50
μ
m larger per side than the corresponding copper pad.
The suggested paste mask layout for the ODIN-W2 series modules is to follow the copper mask layout as
described in Figure 6.
