ODIN-W2 series - System Integration Manual
UBX-14040040 - R03
Advance Information
Handling and soldering
Page 22 of 33
Figure 8: Recommended soldering profile
The modules must not be soldered with a damp heat process.
3.3.3
Optical inspection
After soldering the ODIN-W2 series modules, inspect the modules optically to verify that the module is properly
aligned and centered.
3.3.4
Cleaning
Cleaning the modules is not recommended. Residues underneath the modules cannot be easily removed with a
washing process.
•
Cleaning with water will lead to capillary effects where water is absorbed in the gap between the
baseboard and the module. The combination of residues of soldering flux and encapsulated water leads
to short circuits or resistor-like interconnections between neighboring pads. The water will also damage
the sticker and the ink-jet printed text.
•
Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into the
two housing areas that are not accessible for post-wash inspections. The solvent will also damage the
sticker and the ink-jet printed text.
•
Ultrasonic cleaning will permanently damage the module especially, the quartz oscillators.
For best results use a "no clean" soldering paste and eliminate the cleaning step after the soldering.
3.3.5
Repeated reflow soldering
Only a single reflow soldering process is encouraged for boards with a module populated on it. The reason for
this is the risk of the ODIN-W2 module falling off due to high weight in relation to the adhesive properties of the
solder or the mated RF coaxial cable.
3.3.6
Wave soldering
Boards with combined through-hole technology (THT) components and surface-mount technology (SMT) devices
require wave soldering to solder the THT components. Only a single wave soldering process is encouraged for
boards populated with the modules.
3.3.7
Hand soldering
Hand soldering is not recommended.
