Trenz Electronic TE0300, Руководство пользователя, Страница: 2 / 26

Spartan-3E FPGA
Industrial Micromodule
Rev 1.19 as of 2011-10-04 User Manual
Features
■
High-density plug-in Xilinx Spartan-
3E module
■
USB 2.0 interface with high speed
(480 Mbit/s) data rate
■
Large SPI flash for configuration and
user storage accessible via USB or SPI
connector
■
Large DDR-SDRAM
■
FPGA configuration is implemented via
JTAG, SPI Flash or USB
■
3 on-board high-power, high-effi-
ciency, switch-mode
DC-DC convert-
ers (1 A for each voltage rail: 1.2 V,
2.5 V, 3.3 V)
■
Power supply via USB or B2B (carrier
board)
■
Flexible expansion via high-density
shockproof B2B (board-to-board)
connectors
■
Most I/O's on the B2B connectors are
routed as
LVDS pairs
■
Evenly spread supply pins for good
signal integrity
■
Industrial temperature grade avail-
able on request
■
Low-cost, versatile and ruggedized
design
Specifications
■
FPGA : Xilinx Spartan-3E XC3S500E –
XC3S1600E
■
USB controller : Cypress EZ-USB FX2
USB 2.0 microcontroller CY7C68013A-
56LFX
■
Non volatile memory : 16 MBit - 64
Mbit SPI Flash for FPGA-configuration
and user data
■
Volatile memory : 512 Mbit x 16 DDR
SDRAM with up to 666 Mbyte/s
■
Up to 110 FPGA user I/Os
■
Supply voltage range: 4.0 V – 5.5 V
■
1 push-button
■
1 LED
■
Small size (only 40.5 mm x 47.5 mm)
Trenz Electronic GmbH
1
Trenz Electronic GmbH
info@trenz-electronic.de
www.trenz-electronic.de
Figure 2: TE0300: top view. Figure 1: TE0300: bottom view.