A-7
Themis Computer
A—Connector Pinouts, Signals and Solder Beads
Signal Descriptions
VBAT
Battery voltage (3V or wide range mode depending on solder bead
setting). This pin is only used if an external battery is implemented
as opposed to an internal battery. (If an external battery is not
used, jumper JP6 will be removed).
In
VIN
Input voltage (18V to 36V)
In
PWRBTN_L
This active low input signal is connected to the PWRBTN input of
the SBC module.
In
GBE_MDI[0:3]_P/
N
Gigabit Ethernet Controller: Media Dependent Interface Differen-
tial Pairs 0,1,2,3. The MDI can operate in 1000, 100 and 10 Mbits/
s mode. Some pairs are used per the following:
I/O
GBE_CTREF
Reference voltage for magnetics center tap. The reference voltage
is determined by the requirement of the SBC module PHY and may
be as low as 0V and as high as 3.3V.
When the carrier includes the magnetics, this pin is an open / No
Connect. The magnetics center tap is included on the carrier board
by default.
In
USB[0:3]_P/N
USB differential pairs Port 0 to port 3. All Host USB ports.
I/O
USBpwr[0:3]
USB power source with current protection set to 500mA sustained
current on ports 2 and 3 or 2A surge current / 500mA sustained
current on ports 0 and 1.
In
AUDIO_IN_R/L
Audio Input (left and right channel). Routed thru solder beads to ei-
ther MIC1 or Line1 input ports of the ALC889 Codec.
In
AUDIO_OUT_R/L
Line Out port of the ALC889 Codec.
Out
AUDIO_GND
The AUDIO_GND is connected to the DGND. The return path of
the Audio cable uses these pins.
In
Table A-2.
Signal Descriptions (Continued)
Signal Name
Description
In/O
u
t
1000 Base T
100 Base TX
10 Base T
MDI0_P/N
B1_DA+/-
TX+/-
TX+/-
MDI1_P/N
B1_DB+/-
RX+/-
RX+/-
MDI2_P/N
B1_DC+/-
MDI3_P/N
B1_DD+/-
Содержание NanoPAK
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Страница 92: ...4 10 Themis Computer NanoPAK User Manual Version 1 0 4 3 4 ACPI Settings Figure 4 6 ACPI Settings...
Страница 105: ...4 23 Themis Computer 4 AMI BIOS Setup Utility 4 5 Boot Settings Figure 4 18 Boot Settings...
Страница 109: ...4 27 Themis Computer 4 AMI BIOS Setup Utility 4 7 Advanced Chipset Settings Figure 4 21 Advanced Chipset Settings...
Страница 116: ...4 34 Themis Computer NanoPAK User Manual Version 1 0...
Страница 149: ...C 3 Themis Computer C Repackaging Instructions Figure C 1 Figure C 1 Order of Assembly...
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