X
OMAPL137
( )
ZKB
( )
3
PREFIX
X
DEVICE
SILICON REVISION
Blank = Silicon Revision 1.0
3 = 375 Mhz (Revision B)
= 0°C to 90°C (Commercial Grade)
D = –40°C to 90°C (Industrial Grade)
Blank
PACKAGE TYPE
256 Pin Plastic BGA, with Pb-free
Soldered Balls [Green]
ZKB =
DEVICE SPEED RANGE
TEMPERATURE RANGE (JUNCTION)
A = Silicon Revision 1.1
B = Silicon Revision 2.0
C = Silicon Revision 2.1
D = Silicon Revision 3.0
A = –40°C to 105°C (Extended Grade)
4 = 456 Mhz (Revision B)
3 = 300 Mhz (Revision A)
Blank = Production Device
P
= Experimental Device
= Prototype Device
OMAPL137
T = –40°C to 125°C (Automotive Grade)
OMAP-L137
SPRS563G – SEPTEMBER 2008 – REVISED JUNE 2014
www.ti.com
TI nomenclature also includes a suffix with the device family name. This suffix indicates the package type
(for example, ZKB), the temperature range (for example, "Blank" is the commercial temperature range),
and the device speed range in megahertz (for example, "Blank" is the default).
Figure 7-1
provides a legend for reading the complete device name for any OMAPL13x member.
Figure 7-1. Device Nomenclature
7.2
Documentation Support
The following documents describe the OMAP-L13x Low-power applications processor. Copies of these
documents are available on the Internet at
www.ti.com
.
Tip:
Enter the literature number in the search box
provided at www.ti.com.
DSP Reference Guides
SPRUFE8
TMS320C674x DSP CPU and Instruction Set Reference Guide.
Describes the CPU
architecture, pipeline, instruction set, and interrupts for the TMS320C674x digital signal
processors (DSPs). The C674x DSP is an enhancement of the C64x+ and C67x+ DSPs with
added functionality and an expanded instruction set.
SPRUFK5
TMS320C674x DSP Megamodule Reference Guide.
Describes the TMS320C674x digital
signal processor (DSP) megamodule. Included is a discussion on the internal direct memory
access (IDMA) controller, the interrupt controller, the power-down controller, memory
protection, bandwidth management, and the memory and cache.
SPRUH92
OMAP-L1x DSP+ARM Processor Technical Reference Manual.
Describes the System-on-
Chip (SoC) and each peripheral in the device.
User's Guides
SPRU186
TMS320C6000 Assembly Language Tools User's Guide.
Describes the assembly
language tools (assembler, linker, and other tools used to develop assembly language code),
assembler directives, macros, common object file format, and symbolic debugging directives
for the TMS320C6000 platform of devices (including the C64x+, C67x+, and C674x
generations).
SPRU187
TMS320C6000 Optimizing Compiler User's Guide.
Describes the TMS320C6000 C
compiler and the assembly optimizer. This C compiler accepts ANSI standard C source code
and produces assembly language source code for the TMS320C6000 platform of devices
(including the C64x+, C67x+, and C674x generations). The assembly optimizer helps you
optimize your assembly code.
SPRUG82
TMS320C674x DSP Cache User's Guide.
Explains the fundamentals of memory caches
and describes how the two-level cache-based internal memory architecture in the
TMS320C674x digital signal processor (DSP) can be efficiently used in DSP applications.
216
Device and Documentation Support
Copyright © 2008–2014, Texas Instruments Incorporated
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