40
SLAS826F – MARCH 2015 – REVISED MARCH 2017
Product Folder Links:
Specifications
Copyright © 2015–2017, Texas Instruments Incorporated
(1)
Measured with VCORE = 1.2 V
5.23 Current Consumption of Digital Peripherals
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(1)
PARAMETER
TEST CONDITIONS
TYP
MAX
UNIT
I
TIMER_A
Timer_A configured as PWM timer with 50% duty cycle
5
µA/MHz
I
TIMER32
Timer32 enabled
3.5
µA/MHz
I
UART
eUSCI_A configured in UART mode
6.5
µA/MHz
I
SPI
eUSCI_A configured in SPI master mode
5
µA/MHz
I
I2C
eUSCI_B configured in I
2
C master mode
5
µA/MHz
I
WDT_A
WDT_A configured in interval timer mode
6
µA/MHz
I
RTC_C
RTC_C enabled and sourced from 32-kHz LFXT
100
nA
I
AES256
AES256 active
19
µA/MHz
I
CRC32
CRC32 active
2
µA/MHz
(1)
For more information about traditional and new thermal metrics, see
Semiconductor and IC Package Thermal Metrics
.
(2)
N/A = not applicable
(3)
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(4)
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(5)
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(6)
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
5.24 Thermal Resistance Characteristics
THERMAL METRICS
(1)
PACKAGE
VALUE
(2)
UNIT
R
θ
JA
Junction-to-ambient thermal resistance, still air
(3)
LQFP-100 (PZ)
50.9
°C/W
R
θ
JC(TOP)
Junction-to-case (top) thermal resistance
(4)
9.7
°C/W
R
θ
JB
Junction-to-board thermal resistance
(5)
27.2
°C/W
Ψ
JB
Junction-to-board thermal characterization parameter
26.9
°C/W
Ψ
JT
Junction-to-top thermal characterization parameter
0.2
°C/W
R
θ
JC(BOTTOM)
Junction-to-case (bottom) thermal resistance
(6)
N/A
°C/W
R
θ
JA
Junction-to-ambient thermal resistance, still air
(3)
NFBGA-80 (ZXH)
58.1
°C/W
R
θ
JC(TOP)
Junction-to-case (top) thermal resistance
(4)
26.1
°C/W
R
θ
JB
Junction-to-board thermal resistance
(5)
22.6
°C/W
Ψ
JB
Junction-to-board thermal characterization parameter
22.0
°C/W
Ψ
JT
Junction-to-top thermal characterization parameter
0.5
°C/W
R
θ
JC(BOTTOM)
Junction-to-case (bottom) thermal resistance
(6)
N/A
°C/W
R
θ
JA
Junction-to-ambient thermal resistance, still air
(3)
VQFN-64 (RGC)
29.4
°C/W
R
θ
JC(TOP)
Junction-to-case (top) thermal resistance
(4)
14.8
°C/W
R
θ
JB
Junction-to-board thermal resistance
(5)
8.3
°C/W
Ψ
JB
Junction-to-board thermal characterization parameter
8.2
°C/W
Ψ
JT
Junction-to-top thermal characterization parameter
0.2
°C/W
R
θ
JC(BOTTOM)
Junction-to-case (bottom) thermal resistance
(6)
1.0
°C/W