Conversion 1
Conversion 2
V OUT
Conversion 3
10%
tSRLH
tSRHL
90%
10%
90%
RLoad
AVCC
CLoad = 100pF
2
DAC Output
RO/P(DAC12.x)
ILoad
Conversion 1
Conversion 2
VOUT
Conversion 3
Glitch
Energy
+/- 1/2 LSB
+/- 1/2 LSB
tsettleLH
tsettleHL
= 3 k
W
MSP430FG4619, MSP430FG4618, MSP430FG4617, MSP430FG4616
MSP430CG4619, MSP430CG4618, MSP430CG4617, MSP430CG4616
SLAS508J – APRIL 2006 – REVISED JUNE 2015
www.ti.com
5.37
12-Bit DAC, Dynamic Specifications
V
ref
= V
CC
, DAC12IR = 1, over recommended ranges of supply voltage and operating free-air temperature (unless otherwise
noted) (see
Figure 5-30
and
Figure 5-31
)
PARAMETER
TEST CONDITIONS
V
CC
MIN
TYP MAX
UNIT
DAC12AMPx = 0
→
{2, 3, 4}
60
120
DAC12_xDAT = 800h,
t
ON
DAC12 on time
Error
V(O)
< ±0.5 LSB
(1)
DAC12AMPx = 0
→
{5, 6}
2.2 V, 3 V
15
30
µs
(see
Figure 5-30
)
DAC12AMPx = 0
→
7
6
12
DAC12AMPx = 2
100
200
DAC12_xDAT =
t
S(FS)
Settling time, full scale
DAC12AMPx = 3,5
2.2 V, 3 V
40
80
µs
80h
→
F7Fh
→
80h
DAC12AMPx = 4, 6, 7
15
30
DAC12AMPx = 2
5
DAC12_xDAT =
t
S(C–C)
Settling time, code to code
3F8h
→
408h
→
3F8h
DAC12AMPx = 3,5
2.2 V, 3 V
2
µs
BF8h
→
C08h
→
BF8h
DAC12AMPx = 4, 6, 7
1
DAC12AMPx = 2
0.05
0.12
DAC12_xDAT =
SR
Slew rate
DAC12AMPx = 3,5
2.2 V, 3 V
0.35
0.7
V/µs
80h
→
F7Fh
→
80h
(2)
DAC12AMPx = 4, 6, 7
1.5
2.7
DAC12AMPx = 2
600
DAC12_xDAT =
Glitch energy, full-scale
DAC12AMPx = 3,5
2.2 V, 3 V
150
nV-s
80h
→
F7Fh
→
80h
DAC12AMPx = 4, 6, 7
30
(1)
R
Load
and C
Load
connected to AV
SS
(not AV
CC
/2) in
Figure 5-30
.
(2)
Slew rate applies to output voltage steps
≥
200 mV.
Figure 5-30. Settling Time and Glitch Energy Testing
Figure 5-31. Slew Rate Testing
42
Specifications
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