Processor Family
CC = Embedded RF Radio
MSP = Mixed-Signal Processor
XMS = Experimental Silicon
PMS = Prototype Device
430 MCU Platform
TI’s Low-Power Microcontroller Platform
Device Type
Memory Type
C = ROM
F = Flash
FR = FRAM
G = Flash or FRAM (Value Line)
L = No Nonvolatile Memory
Specialized Application
AFE = Analog Front End
BT = Preprogrammed with
BQ = Contactless Power
CG = ROM Medical
FE = Flash Energy Meter
FG = Flash Medical
FW = Flash Electronic Flow Meter
Bluetooth
Series
1 Series = Up to 8 MHz
2 Series = Up to 16 MHz
3 Series = Legacy
4 Series = Up to 16 MHz with LCD
5 Series = Up to 25 MHz
6 Series = Up to 25 MHz with LCD
0 = Low-Voltage Series
Feature Set
Various Levels of Integration Within a Series
Optional: A = Revision
N/A
Optional: Temperature Range
S = 0°C to 50 C
C to 70 C
I = 40 C to 85 C
T = –40 C to 105 C
°
C = 0°
°
–
°
°
°
°
Packaging
http://www.ti.com/packaging
Optional: Tape and Reel
T = Small Reel
R = Large Reel
No Markings = Tube or Tray
Optional: Additional Features
-EP = Enhanced Product ( 40°C to 105°C)
-HT = Extreme Temperature Parts ( 55°C to 150°C)
-Q1 = Automotive Q100 Qualified
–
–
MSP
430
F
5
438
A
I
ZQW
T
XX
Processor Family
Series
Optional: Temperature Range
430 MCU Platform
Packaging
Device Type
Optional: A = Revision
Optional: Tape and Reel
Feature Set
Optional: Additional Features
MSP430FG4619, MSP430FG4618, MSP430FG4617, MSP430FG4616
MSP430CG4619, MSP430CG4618, MSP430CG4617, MSP430CG4616
SLAS508J – APRIL 2006 – REVISED JUNE 2015
www.ti.com
Figure 7-1. Device Nomenclature
102
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MSP430FG4619 MSP430FG4618 MSP430FG4617 MSP430FG4616 MSP430CG4619
MSP430CG4618 MSP430CG4617 MSP430CG4616