MSP430FG4619, MSP430FG4618, MSP430FG4617, MSP430FG4616
MSP430CG4619, MSP430CG4618, MSP430CG4617, MSP430CG4616
SLAS508J – APRIL 2006 – REVISED JUNE 2015
www.ti.com
5
Specifications
5.1
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Voltage applied at V
CC
to V
SS
–0.3
4.1
V
Voltage applied to any pin
(2)
–0.3
V
CC
+ 0.3
V
Diode current at any device terminal
±2
mA
Unprogrammed device
–55
105
Storage temperature, T
stg
°C
Programmed device
–40
85
(1)
Stresses beyond those listed under
Absolute Maximum Ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating
Conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are referenced to V
SS
.The JTAG fuse-blow voltage, V
FB
, is allowed to exceed the absolute maximum rating. The voltage is
applied to the TDI/TCLK pin when blowing the JTAG fuse.
5.2
ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±1000
V
(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±250
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as
±1000 V may actually have higher performance.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±250 V
may actually have higher performance.
5.3
Recommended Operating Conditions
Typical values are specified at V
CC
= 3.3 V and T
A
= 25°C (unless otherwise noted)
MIN
NOM
MAX
UNIT
During program execution
(1)
1.8
3.6
(AV
CC
= DV
CC1/2
= V
CC
)
During flash memory programming (FG461x)
V
CC
Supply voltage
2.7
3.6
V
(AV
CC
= DV
CC1/2
= V
CC
)
(1)
During program execution, SVS enabled and PORON = 1
(1)
2
3.6
(AV
CC
= DV
CC1/2
= V
CC
)
(2)
V
SS
Supply voltage (AV
SS
= DV
SS1/2
= V
SS
)
0
0
V
T
A
Operating free-air temperature range
–40
85
°C
LF selected, XTS_FLL = 0
(3)
Watch crystal
32.768
f
(LFXT1)
Crystal frequency
(3)
XT1 selected, XTS_FLL = 1
Ceramic resonator
450
8000
kHz
XT1 selected, XTS_FLL = 1
Crystal
1000
8000
Ceramic resonator
450
8000
f
(XT2)
Crystal frequency
kHz
Crystal
1000
8000
V
CC
= 1.8 V
DC
3
f
(System)
Processor frequency (signal MCLK)
V
CC
= 2.0 V
DC
4.6
MHz
V
CC
= 3.6 V
DC
8
(1)
TI recommends powering AV
CC
and DV
CC
from the same source. A maximum difference of 0.3 V between AV
CC
and DV
CC
can be
tolerated during power up and operation.
(2)
The minimum operating supply voltage is defined according to the trip point where POR is going active by decreasing the supply
voltage. POR is going inactive when the supply voltage is raised above the minimum supply voltage plus the hysteresis of the SVS
circuitry.
(3)
In LF mode, the LFXT1 oscillator requires a watch crystal. In XT1 mode, LFXT1 accepts a ceramic resonator or a crystal.
14
Specifications
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