MSP430F5338, MSP430F5336, MSP430F5335, MSP430F5333
www.ti.com
SLAS721D – AUGUST 2010 – REVISED DECEMBER 2015
5.4
Active Mode Supply Current Into V
CC
Excluding External Current
over recommended operating free-air temperature (unless otherwise noted)
(1) (2) (3)
FREQUENCY (f
DCO
= f
MCLK
= f
SMCLK
)
EXECUTION
PARAMETER
V
CC
PMMCOREVx
1 MHz
8 MHz
12 MHz
20 MHz
UNIT
MEMORY
TYP
MAX
TYP
MAX
TYP
MAX
TYP
MAX
0
0.32
0.36
2.1
2.4
1
0.36
2.4
3.6
4.0
I
AM, Flash
Flash
3 V
mA
2
0.37
2.5
3.8
3
0.39
2.7
4.0
6.6
0
0.18
0.21
1.0
1.2
1
0.20
1.2
1.7
1.9
I
AM, RAM
RAM
3 V
mA
2
0.22
1.3
2.0
3
0.23
1.4
2.1
3.6
(1)
All inputs are tied to 0 V or to V
CC
. Outputs do not source or sink any current.
(2)
The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
(3)
Characterized with program executing typical data processing. LDO disabled (LDOEN = 0).
f
ACLK
= 32786 Hz, f
DCO
= f
MCLK
= f
SMCLK
at specified frequency.
XTS = CPUOFF = SCG0 = SCG1 = OSCOFF = SMCLKOFF = 0.
5.5
Low-Power Mode Supply Currents (Into V
CC
) Excluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(1) (2)
–40°C
25°C
60°C
85°C
PARAMETER
V
CC
PMMCOREVx
UNIT
TYP
MAX
TYP
MAX
TYP
MAX
TYP
MAX
2.2 V
0
71
75
87
81
85
99
I
LPM0,1MHz
Low-power mode 0
(3) (4)
µA
3 V
3
78
83
98
89
94
108
2.2 V
0
6.3
6.7
9.9
9.0
11
16
I
LPM2
Low-power mode 2
(5) (4)
µA
3 V
3
6.6
7.0
11
10
12
18
0
1.6
1.8
2.4
4.7
6.5
10.5
2.2 V
1
1.6
1.9
4.8
6.6
2
1.7
2.0
4.9
6.7
Low-power mode 3,
I
LPM3,XT1LF
0
1.9
2.1
2.7
5.0
6.8
10.8
µA
crystal mode
(6) (4)
1
1.9
2.1
5.1
7.0
3 V
2
2.0
2.2
5.2
7.1
3
2.0
2.2
2.9
5.4
7.3
12.6
(1)
All inputs are tied to 0 V or to V
CC
. Outputs do not source or sink any current.
(2)
The currents are characterized with a Micro Crystal CC4V-T1A SMD crystal with a load capacitance of 9 pF. The internal and external
load capacitance are chosen to closely match the required 9 pF.
(3)
Current for watchdog timer clocked by SMCLK included. ACLK = low-frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 (LPM0), f
ACLK
= 32768 Hz, f
MCLK
= 0 MHz, f
SMCLK
= f
DCO
= 1 MHz
LDO disabled (LDOEN = 0).
(4)
Current for brownout included. Low-side supervisor and monitors disabled (SVS
L
, SVM
L
). High-side supervisor and monitor disabled
(SVS
H
, SVM
H
). RAM retention enabled.
(5)
Current for watchdog timer clocked by ACLK and RTC clocked by LFXT1 (32768 Hz) included. ACLK = low-frequency crystal operation
(XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 (LPM2), f
ACLK
= 32768 Hz, f
MCLK
= 0 MHz, f
SMCLK
= f
DCO
= 0 MHz; DCO
setting = 1 MHz operation, DCO bias generator enabled.
LDO disabled (LDOEN = 0).
(6)
Current for watchdog timer clocked by ACLK and RTC clocked by LFXT1 (32768 Hz) included. ACLK = low-frequency crystal operation
(XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3), f
ACLK
= 32768 Hz, f
MCLK
= f
SMCLK
= f
DCO
= 0 MHz
LDO disabled (LDOEN = 0).
Copyright © 2010–2015, Texas Instruments Incorporated
Specifications
17
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