Technosoft iPOS360x MX, Техническое описание

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Technosoft 2014 24 iPOS360x MX Technical Reference
3. Step 1. Hardware Installation
3.1. Mechanical Mounting
The iPOS360x drive is intended to be mounted horizontally on a motherboard equipped with the
recommended mating connectors, as specified in chapter 3.3. Several iPOS360x drives can be
hosted by a single motherboard. For motherboard PCB design, use the dimensional drawing from
Figure 3.1. below.
Figure 3.1. iPOS360x MX PCB Footprint
For thermal calculations, each iPOS360x drive can be assumed to generate 1 Watt at idle, and up
to 3 Watts (= 10 BTU/hour) worst case while driving a motor.
3.2. Motherboard PCB Design
It is recommended to use a multi-layer PCB for the motherboard, in order to have enough room for
routing all the 40 pins of the iPOS360x. Using a 2-layer PCB is possible when some of the iPOS360x
pins remain un-connected.
Below is a list of recommendations for the PCB design of the motherboard:

Motor supply and motor outputs: use islands / areas of copper to escape connector area;
this will maximize current capability. When using simple tracks, use at least 100mil cross
section (75mil track width for 1oz/ft
2
copper thickness)
–
for iPOS3604. Halve these values
for the iPOS3602.

Motor supply and ground return tracks between iPOS360x and the nearby V
MOT
decoupling
capacitor are to be considered as EMI sources, and kept to a minimum length.

Place the decoupling capacitors on V
MOT
and V
LOG
(see also 3.4.11. Power Supply
Connection) as close as physically possible to the iPOS360x, to minimize EM radiated
emissions. For un-shielded applications (no metallic box) and typical EMC regulations, the
spacing between iPOS360x and capacitors must be less than 3 centimeters.