Supermicro X11DGO-T, Руководство пользователя

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Super X11DGO-T User's Manual
Attaching the Processor Package Assembly to the Heatsink to
Form the Processor Heatsink Module (PHM)
After you have made a processor package assembly by following the instructions on the
previous page, please follow the steps below to mount the processor package assembly onto
the heatsink to create the Processor Heatsink Module (PHM).
1. Locate "1" on the heatsink label and the triangular corner next to it on the heatsink. With
your index fi nger pressing against the screw at this triangular corner, carefully hold and turn
the heatsink upside down with the thermal-grease side facing up. Remove the protective
thermal
fi lm if present, and apply the proper amount of the thermal grease as needed.
(Skip this step if you have a new heatsink because the necessary thermal grease is pre-
applied in the factory.)
2. Holding the processor package assembly at the center edge, turn it upside down. With
the thermal-grease side facing up, locate the hollow triangle located at the corner of the
processor carrier assembly ("a" in the graphic). Note a larger hole and plastic mounting
clicks located next to the hollow triangle. Also locate another set of mounting clicks and a
Heatsink
(Upside Down)
CPU and Processor Clip
(Upside Down)
C
D
d
c
a
b
A
B
On Locations of (C, D), the notches
snap onto the heat sink’s
mounting holes
On Locations (A, B), the notches
snap onto the heatsink’s sides
A
B
D
C
Make sure Mounting
Notches snap into place
Triangle on the CPU
Triangle on the
Processor Clip
larger hole at the diagonal corner
of the same (reverse) side of the
processor carrier assembly ("b" in
the graphic).
3. With the back of heatsink and
the reverse side of the processor
package assembly facing up, align
the triangular corner on the heatsink
("A" in the graphic) against the
mounting clips next to the hollow
triangle ("a") on the processor
package assembly.
4. Also align the triangular corner ("B")
at the diagonal side of the heatsink
with the corresponding clips on the
processor package assembly ("b").
5. Once the mounting clips on the
processor package assembly
are properly aligned with the
corresponding holes on the back
of heatsink, securely attach the
heatsink to the processor package
assembly by snapping the mounting
clips at the proper places on the
heatsink to create the processor
heatsink module (PHM).