Appendix C: System Specifications
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Appendix C
Specifications and Compliance
Processors
Dual 3rd Gen Intel Xeon Scalable processor in Socket P+ (LGA-4189) with up to 38 cores per CPU and a thermal design
power (TDP) of up to 270W
Chipset
Intel PCH LBG-2/LBG-4
Memory
Up to 8TB 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM/NV-DIMM DDR4 ECC memory with speeds of 3200/2933/2666 MHz in
32 memory slots
Up to 12TB Intel Optane PMem 200 Series memory* support (512GB x16 + 256GB x16)
*
Note
: PMem 200 Series are supported on 3rd gen Intel Xeon Scalable Platinum, Gold and selected Silver processors.
BIOS
AMI BIOS; ACPI 3.0 or later, PCI firmware 4.0 support, BIOS rescue hot-key, SPI dual/quad speed support, RTC (Real Time
Clock) wakeup, Dual-Boot Block, and SMBIOS 3.0 or later
Motherboard
B12DPE-6
Chassis
MCP-680-61003-0N; 6U height; 9.75” x 1.75” x 23.5” (depth) (24.8 x 4.4 x 59.7 cm)
Storage Drives
Three hot-swap 2.5" hybrid bays:
SBI-620P-1C3N, two NVMe plus one SAS/SATA, or three SAS/SATA
SBI-620P-1T3N, three NVMe or SATA
LAN Connections
Two 25G onboard
Operating Environment
Operating Temperature: 10º to 35º C (50º to 95º F)
Non-operating Temperature: -40º to 70º C (-40º to 158º F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
