1-55
HXC-100/V2 (J, E)
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SY-363 BOARD
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Ref. No.
or Q'ty Part No. SP Description
1pc A-1707-921-A s MOUNTED CIRCUIT BOARD, SY-363
3pcs 3-729-061-02 s SCREW (M2) (TYPE 1)
BT101 1-756-076-21 s HOLDER, LITHIUM BATTERY
C1 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C2 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C3 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C4 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C5 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C8 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C9 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C11 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C12 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C13 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C14 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C15 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C16 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C18 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C19 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C20 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C21 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C22 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C23 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C24 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C25 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C28 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C30 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C31 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C32 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C33 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C34 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005
C36 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C37 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C38 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C42 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C43 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C45 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C46 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C47 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C48 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C49 1-126-400-21 s CAP, CHIP ELECT 22MF(6.3X5.7)
C50 1-126-400-21 s CAP, CHIP ELECT 22MF(6.3X5.7)
C51 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C52 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C53 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C107 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C109 1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C110 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C111 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C112 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C113 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C114 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C115 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C116 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C117 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C118 1-114-999-11 s CAP, DOUBLE LAYERS 0.22F
C119 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C120 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C121 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
(SY-363 BOARD)
Ref. No.
or Q'ty Part No. SP Description
C122 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C123 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C124 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C125 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C126 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C127 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C128 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C129 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C130 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C131 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C132 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C133 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C134 1-164-935-81 s CAP, CHIP CERAMIC 470PF B 1005
C135 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C136 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C137 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C138 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C139 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C140 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C141 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C142 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C143 1-119-923-81 s CAP, CERAMIC 0.047MF B 1005
C144 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C145 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C146 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C147 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C148 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C149 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C150 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C151 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C152 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C153 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C154 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C155 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C156 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C157 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C158 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C159 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C160 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C161 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C162 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C163 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C164 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C165 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C166 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C167 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C168 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C169 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C170 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C171 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C172 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C173 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C175 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C176 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C180 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C181 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C182 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C183 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C184 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
Содержание HXC-100
Страница 1: ...HD COLOR CAMERA HXC 100 SERVICE MANUAL Volume 2 1st Edition ...
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Страница 97: ...2 1 HXC 100 V2 J E 2 1 Section 2 Block Diagrams ...
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Страница 206: ...Sony Corporation HXC 100 UC HXC 100 J HXC 100 CE J E 9 968 627 01 Printed in Japan 2009 4 08 2009 ...