1-45
HXC-100/V2 (J, E)
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ENC-112 BOARD
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Ref. No.
or Q’ty Part No. SP Description
1pc A-1707-917-A s MOUNTED CIRCUIT BOARD, ENC-112
C100 1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C101 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C102 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C103 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C104 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C105 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C106 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C107 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C108 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C109 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C110 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C111 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C112 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C113 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C114 1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C115 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C116 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C117 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C118 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C119 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C120 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C121 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C122 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C123 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C124 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C125 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C126 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C127 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C128 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C129 1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C130 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C131 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C132 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C133 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C134 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C135 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C136 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C137 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C138 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C139 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C140 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C141 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C142 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C143 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C144 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C145 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C146 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C147 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C148 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C149 1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C150 1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C151 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C152 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C153 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C154 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C155 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C156 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
(ENC-112 BOARD)
Ref. No.
or Q’ty Part No. SP Description
C157 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C158 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C159 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C160 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C161 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C162 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C163 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C164 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C165 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C166 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C167 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C168 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C169 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C170 1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C171 1-112-815-91 s CAP, CERAMIC 10MF C (1608)
D100 6-502-197-01 s DI SML-D12M8WT86SM
D101 6-502-197-01 s DI SML-D12M8WT86SM
D102 6-502-197-01 s DI SML-D12M8WT86SM
FB100 1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB101 1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB102 1-469-094-21 s FERRITE, EMI (SMD) (1608)
IC100 8-753-276-37 o IC CXD3195AGG-T6
R100 1-220-878-81 s RES, CHIP 22 (1005)
R101 1-218-990-81 s CONDUCTOR, CHIP (1005)
R102 1-218-990-81 s CONDUCTOR, CHIP (1005)
R103 1-218-990-81 s CONDUCTOR, CHIP (1005)
R104 1-220-878-81 s RES, CHIP 22 (1005)
R105 1-220-878-81 s RES, CHIP 22 (1005)
R106 1-208-911-81 s RES, CHIP 10K (1005)
R107 1-220-878-81 s RES, CHIP 22 (1005)
R108 1-208-911-81 s RES, CHIP 10K (1005)
R109 1-208-911-81 s RES, CHIP 10K (1005)
R110 1-208-911-81 s RES, CHIP 10K (1005)
R111 1-208-911-81 s RES, CHIP 10K (1005)
R112 1-218-990-81 s CONDUCTOR, CHIP (1005)
R113 1-208-887-81 s RES, CHIP 1.0K (1005)
R114 1-208-887-81 s RES, CHIP 1.0K (1005)
R115 1-208-911-81 s RES, CHIP 10K (1005)
R118 1-220-878-81 s RES, CHIP 22 (1005)
R119 1-220-878-81 s RES, CHIP 22 (1005)
R120 1-220-878-81 s RES, CHIP 22 (1005)
R121 1-220-878-81 s RES, CHIP 22 (1005)
RB101 1-234-378-21 s RES, NETWORK 10K (1005X4)
RB102 1-234-378-21 s RES, NETWORK 10K (1005X4)
RB103 1-234-378-21 s RES, NETWORK 10K (1005X4)
RB105 1-234-376-21 s RES, NETWORK 2.2K (1005X4)
RB108 1-234-378-21 s RES, NETWORK 10K (1005X4)
RB109 1-234-378-21 s RES, NETWORK 10K (1005X4)
RB110 1-234-378-21 s RES, NETWORK 10K (1005X4)
RB111 1-234-370-21 s RES, NETWORK 22 (1005X4)
RB112 1-234-370-21 s RES, NETWORK 22 (1005X4)
RB113 1-234-370-21 s RES, NETWORK 22 (1005X4)
RB114 1-234-370-21 s RES, NETWORK 22 (1005X4)
RB115 1-234-370-21 s RES, NETWORK 22 (1005X4)
RB116 1-234-370-21 s RES, NETWORK 22 (1005X4)
RB117 1-234-370-21 s RES, NETWORK 22 (1005X4)
RB118 1-234-370-21 s RES, NETWORK 22 (1005X4)
Содержание HXC-100
Страница 1: ...HD COLOR CAMERA HXC 100 SERVICE MANUAL Volume 2 1st Edition ...
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Страница 206: ...Sony Corporation HXC 100 UC HXC 100 J HXC 100 CE J E 9 968 627 01 Printed in Japan 2009 4 08 2009 ...